探索Nexperia豐富的核心半導(dǎo)體產(chǎn)品組合，這些產(chǎn)品為全球幾乎所有商用電子設(shè)計(jì)的基礎(chǔ)功能提供支持——涵蓋汽車(chē)、工業(yè)、移動(dòng)及消費(fèi)類(lèi)應(yīng)用領(lǐng)域。

所有產(chǎn)品

種類(lèi)繁多的雙極晶體管助您輕松滿足系統(tǒng)需求。產(chǎn)品線涵蓋基礎(chǔ)雙極晶體管模塊，以及一系列節(jié)省空間和成本的帶電阻晶體管，直至我們突破性的小信號(hào)系列低壓降電壓器件。

二極管

我們豐富的二極管產(chǎn)品組合為您提供當(dāng)今市場(chǎng)所需的靈活性——無(wú)論是簡(jiǎn)單的齊納二極管、高效的肖特基整流器、快速恢復(fù)二極管還是可控雪崩開(kāi)關(guān)二極管。

ESD保護(hù)、TVS、信號(hào)調(diào)節(jié)

涵蓋靜電放電保護(hù)、瞬態(tài)電壓抑制器件、共模扼流圈及電磁干擾濾波器，Nexperia的保護(hù)技術(shù)持續(xù)升級(jí)，在業(yè)界最小封裝中提供最高級(jí)別的防護(hù)。

MOSFET

Nexperia提供種類(lèi)豐富的低/中壓（12-200 V）P溝道和N溝道硅MOSFET產(chǎn)品組合，采用多種節(jié)省空間且高效的封裝方案。

SiC MOSFETs

Nexperia的1200V碳化硅（SiC）MOSFET重新定義了安全、穩(wěn)健且可靠的電源開(kāi)關(guān)標(biāo)準(zhǔn)，成為電動(dòng)汽車(chē)充電基礎(chǔ)設(shè)施、光伏逆變器及電機(jī)驅(qū)動(dòng)領(lǐng)域的首選產(chǎn)品。
- 1200 V SiC MOSFETs

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

針對(duì)各類(lèi)高壓（650 V）和低壓（40-150 V）應(yīng)用場(chǎng)景，Nexperia氮化鎵場(chǎng)效應(yīng)晶體管憑借更低的導(dǎo)通損耗與開(kāi)關(guān)損耗，實(shí)現(xiàn)了最快速的過(guò)渡/開(kāi)關(guān)能力、最佳的功率效率以及更高的功率密度。

絕緣柵雙極晶體管(IGBTs)

為滿足高效高壓電源轉(zhuǎn)換和電機(jī)驅(qū)動(dòng)日益增長(zhǎng)的需求，Nexperia的IGBT采用堅(jiān)固且經(jīng)濟(jì)高效的載流子存儲(chǔ)溝槽柵極（CSTBT）先進(jìn)場(chǎng)截止（FS）結(jié)構(gòu)。
- 650 / 1200 V discrete IGBTs

模擬和邏輯IC

除全面的邏輯功能、模擬開(kāi)關(guān)和I2C接口產(chǎn)品組合外，Nexperia還提供日益豐富的功率IC產(chǎn)品線，助力打造創(chuàng)新解決方案，專(zhuān)注于降低客戶物料清單成本，提升系統(tǒng)效率與可靠性。

汽車(chē)

為助力實(shí)現(xiàn)互聯(lián)電動(dòng)及混合動(dòng)力車(chē)輛，Nexperia半導(dǎo)體提供全系列符合AEC-Q100/Q101認(rèn)證的器件，涵蓋我們完整的產(chǎn)品組合，這些產(chǎn)品兼具高效能與高效設(shè)計(jì)特性。

應(yīng)用

所有應(yīng)用

秉承創(chuàng)新與可持續(xù)發(fā)展的理念，我們的組件在效率方面樹(shù)立了行業(yè)標(biāo)桿，助力全球客戶為世界各地幾乎所有商用電子設(shè)計(jì)開(kāi)發(fā)節(jié)能高效的尖端解決方案

所有應(yīng)用

汽車(chē)

當(dāng)今汽車(chē)正經(jīng)歷著該行業(yè)有史以來(lái)最重大的變革。持續(xù)推進(jìn)的電氣化進(jìn)程正引發(fā)從動(dòng)力總成到云端系統(tǒng)的深刻變革，越來(lái)越多的電子功能被引入以提升安全性和舒適性。

工業(yè)和電力

從工業(yè)自動(dòng)化到可再生能源及電動(dòng)出行解決方案，Nexperia憑借久經(jīng)考驗(yàn)的品質(zhì)、穩(wěn)定的大規(guī)模供應(yīng)、終身可靠性與產(chǎn)品長(zhǎng)壽命特性，助力工業(yè)持續(xù)運(yùn)轉(zhuǎn)。

移動(dòng)和可穿戴應(yīng)用

智能手機(jī)已牢牢扎根于我們的生活——它們是獲取信息、社交聯(lián)絡(luò)、娛樂(lè)消遣以及銀行服務(wù)到卡路里計(jì)算等全方位服務(wù)的不可或缺工具。但要實(shí)現(xiàn)這些功能，手機(jī)需要采用占用電路板空間小、能延長(zhǎng)電池續(xù)航時(shí)間并支持復(fù)雜功能的組件。

計(jì)算和消費(fèi)電子

當(dāng)我們想到計(jì)算和消費(fèi)類(lèi)應(yīng)用時(shí)，往往會(huì)聯(lián)想到筆記本電腦和洗衣機(jī)。然而當(dāng)今的應(yīng)用已催生出一大批創(chuàng)新產(chǎn)品——從掃地機(jī)器人到自動(dòng)充電遙控器。

子系統(tǒng)：電源轉(zhuǎn)換拓?fù)浣Y(jié)構(gòu)

幾乎所有電子設(shè)備都依賴某種形式的電源轉(zhuǎn)換。無(wú)論是將交流電網(wǎng)電源轉(zhuǎn)換為直流電源軌，提升直流電池電壓，還是簡(jiǎn)單地處理當(dāng)今電子系統(tǒng)中日益多樣化的電源軌。

子系統(tǒng)

任何復(fù)雜系統(tǒng)均可分解為若干子系統(tǒng)，這些子系統(tǒng)可應(yīng)用于眾多領(lǐng)域。從電機(jī)驅(qū)動(dòng)器和電源裝置到用于穩(wěn)定驅(qū)動(dòng)LED燈串的恒流源，這些子系統(tǒng)之間的唯一區(qū)別在于其規(guī)格參數(shù)和整體效率。

參考設(shè)計(jì)

探索我們豐富的Nexperia參考設(shè)計(jì)及第三方評(píng)估板與參考設(shè)計(jì)系列。這些解決方案采用最先進(jìn)的半導(dǎo)體技術(shù)，提供完整的系統(tǒng)、子系統(tǒng)及專(zhuān)業(yè)功能，可無(wú)縫集成至您的項(xiàng)目中。

全部參考設(shè)計(jì)

評(píng)估板

深入了解我們的產(chǎn)品如何為您的應(yīng)用帶來(lái)益處——無(wú)論是優(yōu)化效率、增強(qiáng)穩(wěn)健性還是提升可靠性，只需親自嘗試我們?nèi)娴脑u(píng)估板系列即可。

全部評(píng)估板

交互式應(yīng)用說(shuō)明

Nexperia交互式應(yīng)用說(shuō)明采用PartQuest Explore仿真技術(shù)，將傳統(tǒng)書(shū)面應(yīng)用說(shuō)明賦予生動(dòng)呈現(xiàn)。通過(guò)嵌入式仿真技術(shù)，為各類(lèi)電源設(shè)計(jì)與拓?fù)浣Y(jié)構(gòu)提供指導(dǎo)方案，顯著提升用戶體驗(yàn)。

進(jìn)階輔助工具

Nexperia不僅致力于開(kāi)發(fā)高性能功率產(chǎn)品和創(chuàng)新功率技術(shù)，更致力于打造最先進(jìn)的工具，為設(shè)計(jì)工程師提供知識(shí)、學(xué)習(xí)資源和技術(shù)支持。

質(zhì)量

支持

商店

工作機(jī)會(huì)

關(guān)于我們

新聞

博客

化學(xué)成分 PESD5V0H1BLG-Q

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估?？蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見(jiàn)限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934665103303	PESD5V0H1BLG-QZ	PESD5V0H1BLG-Q	SOD882LD-1 (DFN1006LD-2)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 2014 ppm; substance 7440-02-0: 116 ppm; substance 65997-17-3: 37332 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 2014 ppm; substance 7440-02-0: 116 ppm; substance 75980-60-8: 3 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 102 ppm; substance 7440-57-5: 760 ppm; substance 7440-05-3: 2827 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	0.043280	78.690808	15.293286
Die	Dielectric Layer	Quartz (SiO2)	14808-60-7	0.003447	6.267050	1.218021
Die	Additive	Non-declarable		0.001575	2.864289	0.556537
		Semiconductor Substrate Total		0.048302	87.822147	17.067844
Die	Pure metal layer	Copper (Cu)	7440-50-8	0.000040	0.072356	0.014134
		Under Bump Metallization 1 Total		0.000040	0.072356	0.014134
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.000005	0.009072	0.001767
		Under Bump Metallization 2 Total		0.000005	0.009072	0.001767
Die	Pure metal	Copper (Cu)	7440-50-8	0.003982	7.239317	1.407067
		Bumping 1 Total		0.003982	7.239317	1.407067
Die	Tin alloy	Tin (Sn)	7440-31-5	0.001608	2.922962	0.568198
Die	Tin alloy	Silver (Ag)	7440-22-4	0.000029	0.053534	0.010248
		Bumping 2 Total		0.001637	2.976496	0.578446
Die	Polymer	Polyimide resin		0.001034	1.880612	0.365371
		Passivation Total		0.001034	1.880612	0.365371
		Die Total		0.055000	100.000000	19.434629

Mould Compound	Filler	Silica fused	60676-86-0	0.062700	55.000000	22.155477
Mould Compound	Filler	Silica	7631-86-9	0.034200	30.000000	12.084806
Mould Compound	Polymer	Phenolic resin		0.006840	6.000000	2.416961
Mould Compound	Polymer	Epoxy resin system		0.006270	5.500000	2.215548
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.003420	3.000000	1.208481
Mould Compound	Pigment	Carbon black	1333-86-4	0.000570	0.500000	0.201413
		Mould Compound Total		0.114000	100.000000	40.282686

Substrate/Laminate	Pure metal layer	Nickel (Ni)	7440-02-0	0.000033	0.028890	0.011661
		Plating 1 Total		0.000033	0.028890	0.011661
Substrate/Laminate	Pure metal layer	Gold (Au)	7440-57-5	0.000215	0.188450	0.075972
		Plating 2 Total		0.000215	0.188450	0.075972
Substrate/Laminate	Pure metal layer	Palladium (Pd)	7440-05-3	0.000800	0.701890	0.282685
		Plating 3 Total		0.000800	0.701890	0.282685
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.000001	0.001120	0.000353
		Plating 4 Total		0.000001	0.001120	0.000353
Substrate/Laminate	Pure metal layer	Titanium (Ti)	7440-32-6	0.000011	0.009260	0.003887
		Plating 5 Total		0.000011	0.009260	0.003887
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.082283	72.177950	29.075265
Substrate/Laminate	Impurity	Phosphorus (P)	7723-14-0	0.000011	0.009790	0.003887
		Plating 6 Total		0.082294	72.187740	29.079152
Substrate/Laminate	Fiberglass	Glass, oxide, chemicals (fibrous)	65997-17-3	0.010565	9.267530	3.733215
Substrate/Laminate	Filler	Silica fused	60676-86-0	0.010493	9.204680	3.707774
Substrate/Laminate	Polymer	Resin system		0.005113	4.484670	1.806714
Substrate/Laminate	Impurity	Calcium fluoride	7789-75-5	0.000018	0.015770	0.006360
		Pre-preg Total		0.026189	22.972650	9.254063
Substrate/Laminate	Polymer	Acrylic resin		0.002344	2.055930	0.828269
Substrate/Laminate	Flame retardant	Barium sulfate (BaSO4)	7727-43-7	0.001627	1.427040	0.574912
Substrate/Laminate	Additive	Non-declarable		0.000258	0.226650	0.091166
Substrate/Laminate	Additive	Talc	14807-96-6	0.000191	0.167890	0.067491
Substrate/Laminate	Pigment	C.I. Pigment Blue 15	147-14-8	0.000033	0.029380	0.011661
Substrate/Laminate	Impurity	2-Benzyl-2-(dimethylamino)-1-(4-morpholinophenyl)-1-butanone	119313-12-1	0.000002	0.001970	0.000707
Substrate/Laminate	Impurity	(2,4,6-Trimethylbenzoyl)diphenylphosphine oxide	75980-60-8	0.000001	0.000460	0.000353
Substrate/Laminate	Impurity	Misc. chlorine compounds (generic)		0.000001	0.000680	0.000353
		Solder Mask Total		0.004457	3.910000	1.574912
		Substrate/Laminate Total		0.114000	100.000000	40.282685

		PESD5V0H1BLG-Q Total		0.283000		100.000000

Notes
Report created on 2025-11-03 10:37:35 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-11-03 10:37:35 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體襯底 (Semiconductor Substrate)	?	?	?	?	?	?
底部金屬層1 (Under Bump Metallization 1)	?	?	?	?	?	?
底部金屬層2 (Under Bump Metallization 2)	?	?	?	?	?	?
凸塊1 (Bumping 1)	?	?	?	?	?	?
凸塊2 (Bumping 2)	?	?	?	?	?	?
鈍化層 (Passivation)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
鍍層1 (Plating 1)	?	?	?	?	?	?
鍍層2 (Plating 2)	?	?	?	?	?	?
鍍層3 (Plating 3)	?	?	?	?	?	?
鍍層4 (Plating 4)	?	?	?	?	?	?
鍍層5 (Plating 5)	?	?	?	?	?	?
鍍層6 (Plating 6)	?	?	?	?	?	?
黏合膠片 (Pre-preg)	?	?	?	?	?	?
防焊綠漆 (Solder Mask)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-11-03 10:37:35 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車(chē)應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 PESD5V0H1BLG-Q

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)