74AHC374-Q100; 74AHCT374-Q100
Octal D-type flip-flop; positive edge-trigger; 3-state
The 74AHC374?-?Q100; 74AHCT374?-?Q100 is an octal positive?-?edge triggered D?-?type flip?-?flop with 3?-?state outputs. The device features a clock (CP) and output enable (OE) inputs. The flip?-?flops will store the state of their individual D?-?inputs that meet the set?-?up and hold time requirements on the LOW?-?to?-?HIGH clock (CP) transition. A HIGH on OE causes the outputs to assume a high?-?impedance OFF?-?state. Operation of the OE input does not affect the state of the flip?-?flops. Inputs are overvoltage tolerant. The 74AHCT374?-?Q100 device features TTL compatible inputs that are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Balanced propagation delays
All inputs have Schmitt-trigger actions
Wide supply voltage range from 2.0 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
Common 3-state output enable input
Input levels:
For 74AHC374-Q100: CMOS level
For 74AHCT374-Q100: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC374D-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | 185 | low | -40~125 | 84 | 27 | 61 | SO20 |
| 74AHC374PW-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | 185 | low | -40~125 | 100 | 4.5 | 44.5 | TSSOP20 |
| 74AHCT374D-Q100 | 4.5?-?5.5 | TTL | ± 8 | 4.3 | 140 | low | -40~125 | 84 | 27 | 61 | SO20 |
| 74AHCT374PW-Q100 | 4.5?-?5.5 | TTL | ± 8 | 4.3 | 140 | low | -40~125 | 100 | 4.5 | 44.5 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC374D-Q100 | 74AHC374D‑Q100J (935301376118) |
Active | 74AHC374D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHC374PW-Q100 | 74AHC374PW‑Q100J (935301203118) |
Active | AHC374 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74AHCT374D-Q100 | 74AHCT374D‑Q100J (935303392118) |
Active | 74AHCT374D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHCT374PW-Q100 | 74AHCT374PW‑Q100J (935301387118) |
Active | AHCT374 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC374D-Q100 | 74AHC374D‑Q100J | 74AHC374D-Q100 |
|
|
| 74AHC374PW-Q100 | 74AHC374PW‑Q100J | 74AHC374PW-Q100 |
|
|
| 74AHCT374D-Q100 | 74AHCT374D‑Q100J | 74AHCT374D-Q100 |
|
|
| 74AHCT374PW-Q100 | 74AHCT374PW‑Q100J | 74AHCT374PW-Q100 |
|
|
文檔 (12)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT374_Q100 | Octal D-type flip-flop; positive edge-trigger; 3-state | Data sheet | 2023-09-04 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc374 | ahc374 IBIS model | IBIS model | 2013-04-08 |
| ahct374 | ahct374 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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