74HC377-Q100; 74HCT377-Q100
Octal D-type flip-flop with data enable; positive-edge trigger
The 74HC377-Q100; 74HCT377-Q100 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and data enable (E) inputs. When E is LOW, the outputs Qn assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW??-??to??-??HIGH clock (CP) transition. Input E must be stable one set-up time prior to the LOW?-?to?-?HIGH transition for predictable operation. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
Common clock and master reset
Eight positive edge-triggered D-type flip-flops
Input levels:
For 74HC377-Q100: CMOS level
For 74HCT377-Q100: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC377D-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 13 | 83 | low | -40~125 | 80 | 22.7 | 56 | SO20 |
| 74HC377PW-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 13 | 83 | low | -40~125 | 97 | 3.7 | 41.1 | TSSOP20 |
| 74HCT377D-Q100 | 4.5?-?5.5 | TTL | ± 6 | 14 | 53 | low | -40~125 | 80 | 22.7 | 56 | SO20 |
| 74HCT377PW-Q100 | 4.5?-?5.5 | TTL | ± 6 | 14 | 53 | low | -40~125 | 97 | 3.7 | 41.1 | TSSOP20 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC377D-Q100 | 74HC377D‑Q100J (935301657118) |
Active | 74HC377D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HC377PW-Q100 | 74HC377PW‑Q100J (935301658118) |
Active | HC377 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74HCT377D-Q100 | 74HCT377D‑Q100J (935301661118) |
Active | 74HCT377D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HCT377PW-Q100 | 74HCT377PW‑Q100J (935301662118) |
Active | HCT377 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC377DB-Q100 | 74HC377DB‑Q100J (935301659118) |
Obsolete | HC377 |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT339-1_118 |
| 74HCT377DB-Q100 | 74HCT377DB‑Q100J (935301663118) |
Obsolete | HCT377 |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT339-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC377D-Q100 | 74HC377D‑Q100J | 74HC377D-Q100 |
|
|
| 74HC377PW-Q100 | 74HC377PW‑Q100J | 74HC377PW-Q100 |
|
|
| 74HCT377D-Q100 | 74HCT377D‑Q100J | 74HCT377D-Q100 |
|
|
| 74HCT377PW-Q100 | 74HCT377PW‑Q100J | 74HCT377PW-Q100 |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC377DB-Q100 | 74HC377DB‑Q100J | 74HC377DB‑Q100 |
|
|
| 74HCT377DB-Q100 | 74HCT377DB‑Q100J | 74HCT377DB‑Q100 |
|
|
文檔 (13)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT377_Q100 | Octal D-type flip-flop with data enable; positive-edge trigger | Data sheet | 2024-08-05 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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