CBT16210
20-bit bus switch with 10-bit output enables
The CBT16210 provides 20 bits of high-speed TTL-compatible bus switching. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.
The device is organized as a dual 10-bit bus switch with separate output-enable (OE) inputs. It can be used as two 10-bit bus switches or as one 20-bit bus switch. When OE is low, the associated 10-bit bus switch is on, and port A is connected to port B. When OE is high, the switch is open, and a high-impedance state exists between the ports.
The CBT16210 is characterized for operation from -40 °C to +85 °C.
Features and benefits
- 5 Ω switch connection between two ports
- TTL compatible control input levels
- Package options include shrink small outline (SSOP) and thin shrink small outline (TSSOP)
- ESD exceeds: CDM 1000 V; HBM 2000 V
Applications
參數(shù)類型
| 型號(hào) |
|---|
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBT16210DL | CBT16210DL,112 (935269667112) |
Obsolete | CBT16210DL Standard Procedure Standard Procedure |
SSOP48 (SOT370-1) |
SOT370-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無(wú)信息 |
| CBT16210DL,118 (935269667118) |
Obsolete | CBT16210DL Standard Procedure Standard Procedure | SOT370-1_118 | ||||
| CBT16210DL,518 (935269667518) |
Obsolete | CBT16210DL Standard Procedure Standard Procedure | 暫無(wú)信息 | ||||
| CBT16210DL,512 (935269667512) |
Obsolete | CBT16210DL Standard Procedure Standard Procedure | 暫無(wú)信息 |
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBT16210DL | CBT16210DL,112 | CBT16210DL |
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| CBT16210DL | CBT16210DL,118 | CBT16210DL |
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| CBT16210DL | CBT16210DL,518 | CBT16210DL |
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| CBT16210DL | CBT16210DL,512 | CBT16210DL |
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文檔 (7)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| CBT16210 | 20-bit bus switch with 10-bit output enables | Data sheet | 2000-10-11 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| cbt16210 | cbt16210 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| cbt16210 | cbt16210 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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