CBTD3306
Dual bus switch with level shifting
The CBTD3306 dual FET bus switch features independent line switches. Each switch is disabled when the associated output enable (nOE) input is HIGH.
Features and benefits
Designed to be used in 5 V to 3.3 V level shifting applications with internal diode
5 Ω switch connection between two ports
TTL-compatible input levels
IOFF circuitry provides partial Power-down mode operation
Latch-up protection exceeds 100 mA per JESD78B
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
參數(shù)類型
| 型號(hào) | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CBTD3306GT | 4.5?-?5.5 | 3.3 | TTL | 7 | 300 | 2 | 0.25 | very low | -40~85 | 353 | 7.6 | 175 | XSON8 |
| CBTD3306PW | 4.5?-?5.5 | 3.3 | TTL | 7 | 300 | 2 | 0.25 | very low | -40~85 | 120 | 30 | 87.5 | TSSOP8 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBTD3306GT | CBTD3306GT,115 (935291421115) |
Active | W06 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
| CBTD3306PW | CBTD3306PW,118 (935270512118) |
Active | D306 |
TSSOP8 (SOT530-1) |
SOT530-1 | SOT530-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBTD3306D | CBTD3306D,112 (935270513112) |
Obsolete | CBD3306 |
SO8 (SOT96-1) |
SOT96-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暫無(wú)信息 |
| CBTD3306D,118 (935270513118) |
Obsolete | CBD3306 | SOT96-1_118 | ||||
| CBTD3306GM | CBTD3306GM,125 (935291419125) |
Obsolete |
XQFN8 (SOT902-2) |
SOT902-2 | SOT902-2_125 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBTD3306GT | CBTD3306GT,115 | CBTD3306GT |
|
|
| CBTD3306PW | CBTD3306PW,118 | CBTD3306PW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBTD3306D | CBTD3306D,112 | CBTD3306D |
|
|
| CBTD3306D | CBTD3306D,118 | CBTD3306D |
|
|
| CBTD3306GM | CBTD3306GM,125 | CBTD3306GM |
|
|
文檔 (20)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| CBT3306 | Dual bus switch | Data sheet | 2024-06-06 |
| CBTD3306 | Dual bus switch with level shifting | Data sheet | 2024-06-05 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| sa00534 | Block diagram: CBTD3306D, CBTD3306PW | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| SOT530-1 | 3D model for products with SOT530-1 package | Design support | 2023-02-07 |
| cbtd3306 | cbtd3306 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
| SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| SOT530-1 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-03 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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