74LVC1G157
Single 2-input multiplexer
The 74LVC1G157 is a single 2-input multiplexer. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
High noise immunity
±24 mA output drive (VCC = 3.0 V)
CMOS low power dissipation
Direct interface with TTL levels
Overvoltage tolerant inputs to 5.5 V
IOFF circuitry provides partial Power-down mode operation
Latch-up performance exceeds 250 mA
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD36 (4.5 V to 5.5 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類(lèi)型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G157GM | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.2 | low | -40~125 | 307 | 7.5 | 155 | XSON6 |
| 74LVC1G157GN | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.2 | low | -40~125 | 322 | 20.4 | 199 | XSON6 |
| 74LVC1G157GS | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.2 | low | -40~125 | 311 | 25.9 | 207 | XSON6 |
| 74LVC1G157GV | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.2 | low | -40~125 | 249 | 53.8 | 162 | TSOP6 |
| 74LVC1G157GW | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.2 | low | -40~125 | 276 | 49.4 | 164 | TSSOP6 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G157GM | 74LVC1G157GM,115 (935278312115) |
Active | YP |
XSON6 (SOT886) |
SOT886 | SOT886_115 | |
| 74LVC1G157GM,132 (935278312132) |
Active | YP | SOT886_132 | ||||
| 74LVC1G157GN | 74LVC1G157GN,132 (935291778132) |
Active | YP |
XSON6 (SOT1115) |
SOT1115 | SOT1115_132 | |
| 74LVC1G157GS | 74LVC1G157GS,132 (935292904132) |
Active | YP |
XSON6 (SOT1202) |
SOT1202 | SOT1202_132 | |
| 74LVC1G157GV | 74LVC1G157GV,125 (935278313125) |
Active | YP |
TSOP6 (SOT457) |
SOT457 |
WAVE_BG-BD-1
|
SOT457_125 |
| 74LVC1G157GW | 74LVC1G157GW,125 (935278315125) |
Active | YP |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G157GF | 74LVC1G157GF,132 (935282413132) |
Obsolete |
XSON6 (SOT891) |
SOT891 | SOT891_132 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G157GM | 74LVC1G157GM,115 | 74LVC1G157GM |
|
|
| 74LVC1G157GM | 74LVC1G157GM,132 | 74LVC1G157GM |
|
|
| 74LVC1G157GN | 74LVC1G157GN,132 | 74LVC1G157GN |
|
|
| 74LVC1G157GS | 74LVC1G157GS,132 | 74LVC1G157GS |
|
|
| 74LVC1G157GV | 74LVC1G157GV,125 | 74LVC1G157GV |
|
|
| 74LVC1G157GW | 74LVC1G157GW,125 | 74LVC1G157GW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G157GF | 74LVC1G157GF,132 | 74LVC1G157GF |
|
|
文檔 (32)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74LVC1G157 | Single 2-input multiplexer | Data sheet | 2023-08-15 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| 001aac654 | Block diagram: 74LVC1G157GF, 74LVC1G157GM, 74LVC1G157GV, 74LVC1G157GW | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g157 | 74LVC1G157 IBIS model | IBIS model | 2014-10-20 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g157 | 74LVC1G157 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
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