NEVB-LOGIC02封裝尺寸適配板
NEVB-LOGIC02是一款雙列內(nèi)嵌式邏輯器件封裝尺寸適配板，其設(shè)計旨在通過提供多種封裝尺寸，簡化對Nexperia邏輯器件的評估過程。
NEVB-LOGIC02 footprint adapter board
主要特性與優(yōu)勢
• 即插即用：確認(rèn)待使用的封裝，將器件放入相應(yīng)封裝尺寸中，焊接固定器件，即可開始評估。
• 兼容多種封裝：
XSON8 p0.5
XSON8 p0.3
X2SON8
X2SON6
XSON6
TSSOP6
VSSOP8
TSSOP24
Packages on the board (8)
| 封裝 | 封裝名稱 | 封裝版本 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|---|
XSON8 (SOT833-1) |
XSON8 | SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | MO-252 (JEDEC) | 2007-12-07 |
XSON8 (SOT1116) |
XSON8 | SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | 2010-04-07 | |
X2SON8 (SOT1233) |
X2SON8 | plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1.35 mm x 0.8 mm x 0.35 mm body | 2016-04-21 | ||
X2SON6 (SOT1255) |
X2SON6 | SOT1255 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | 2015-07-22 | |
XSON6 (SOT886) |
XSON6 | SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | MO-252 (JEDEC) | 2004-07-22 |
TSSOP6 (SOT363) |
TSSOP6 | SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | SC-88; SC-70-6 (EIAJ) | 2006-03-16 |
VSSOP8 (SOT765-1) |
VSSOP8 | SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | MO-187 (JEDEC) | 2016-05-31 |
TSSOP24 (SOT355-1) |
TSSOP24 | SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
相關(guān)板塊 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board | ||
|
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
Packages on the board (8)
| 封裝 | 封裝名稱 | 封裝版本 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|---|
|
XSON8 (SOT833-1) |
XSON8 | SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | MO-252 (JEDEC) | 2007-12-07 |
|
XSON8 (SOT1116) |
XSON8 | SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | 2010-04-07 | |
|
X2SON8 (SOT1233) |
X2SON8 | plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1.35 mm x 0.8 mm x 0.35 mm body | 2016-04-21 | ||
|
X2SON6 (SOT1255) |
X2SON6 | SOT1255 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | 2015-07-22 | |
|
XSON6 (SOT886) |
XSON6 | SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | MO-252 (JEDEC) | 2004-07-22 |
|
TSSOP6 (SOT363) |
TSSOP6 | SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | SC-88; SC-70-6 (EIAJ) | 2006-03-16 |
|
VSSOP8 (SOT765-1) |
VSSOP8 | SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | MO-187 (JEDEC) | 2016-05-31 |
|
TSSOP24 (SOT355-1) |
TSSOP24 | SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
相關(guān)板塊 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
|
nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board | ||
|
|
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
文檔 (1)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2024-01-24 |