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NPN Darlington transistor
NPN Darlington transistor in an SOT223 Surface-Mounted Device (SMD) plastic package.
PNP complement: BSP60
Alternatives
Features and benefits
High current of 1 A
Low voltage of 45 V
Integrated diode and resistor
Applications
Industrial high gain amplification
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | hFE [min] | toff (ns) | fT [min] (MHz) | Polarity | IC [max] (mA) | VCES [max] (V) | Ptot [max] (mW) | Complement | IC [max] (mA) | Ptot [max] (mW) | VCES [max] (V) | fT [min] (MHz) | hFE [max] | hFE [min] | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP50 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 2000 | 1300 | 200 | NPN | 1000 | 45 | 1250 | BSP60 | 1000 | 1250 | 45 | 200 | >2000 | 2000 | N |
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BSP50 | BSP50,115 (933986330115) |
Discontinued / End-of-life | BSP50 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BSP50 | BSP50,115 | BSP50 |
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Series
文檔 (12)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BSP50 | NPN Darlington transistor | Data sheet | 2018-06-06 |
| AN90063 | Questions about package outline drawings | Application note | 2025-09-15 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| DERATSMD | Power Derating Curves for SMDs; General | Other type | 1999-05-06 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| BSP50_Nexperia_Product_Reliability | BSP50 Nexperia Product Reliability | Quality document | 2025-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| BSP50 | BSP50 SPICE model | SPICE model | 2025-07-09 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.