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Click here for more informationPMCM6501UNE
20 V, N-channel Trench MOSFET
N-channel enhancement mode Field-Effect Transistor (FET) in a 6 bumps Wafer Level Chip-Size Package (WLCSP) using Trench MOSFET technology.
Features and benefits
Low threshold voltage
Ultra small package: 0.98 × 1.48 × 0.35 mm
Trench MOSFET technology
ElectroStatic Discharge (ESD) protection > 2 kV HBM
Applications
Relay driver
High-speed line driver
Low-side loadswitch
Switching circuits
參數(shù)類型
| 型號 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | VGS [max] (V) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | Ptot [max] (W) | VGSth @25 C [min] (V) | VGSth [typ] (V) | VGSth [max] @25 C (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMCM6501UNE | WLCSP6_3-2 | WLCSP6 | End of life | N | 1 | 20 | 8 | 21 | 25 | 150 | 8.7 | 5.8 | 19 | 0.556 | 0.4 | 0.6 | 0.9 | N | 1050 | 190 | 2017-04-17 |
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PMCM6501UNE | PMCM6501UNEZ (934070323023) |
Discontinued / End-of-life | AE |
WLCSP6 (WLCSP6_3-2) |
WLCSP6_3-2 | 暫無信息 |
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PMCM6501UNE | PMCM6501UNEZ | PMCM6501UNE |
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Series
文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PMCM6501UNE | 20 V, N-channel Trench MOSFET | Data sheet | 2023-06-02 |
| AN11261 | RC Thermal Models | Application note | 2025-09-10 |
| AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
| WLCSP6_3-2 | 3D model for products with WLCSP6_3-2 package | Design support | 2023-03-13 |
| nexperia_document_leaflet_SsMOS_for_mobile_2022-CHN | 適合移動和便攜式設(shè)備的 大批量小信號MOSFET， 采用WLCSP和無引腳DFN封裝 | Leaflet | 2022-07-04 |
| nexperia_document_leaflet_SsMOS_for_mobile_2022 | High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages | Leaflet | 2022-07-04 |
| nexperia_document_leaflet_WLCSP_201803 | Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) | Leaflet | 2018-04-25 |
| nexperia_document_leaflet_WLCSP_201803_CHN | WLCSP Chinese Translation | Leaflet | 2018-04-25 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| nexperia_document_leaflet_WLCSP_201803 | Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) | Leaflet | 2018-04-25 |
| nexperia_document_leaflet_WLCSP_201803_CHN | WLCSP Chinese Translation | Leaflet | 2018-04-25 |
| WLCSP6_3-2 | wafer level chip-size package; 6 bumps (3 x 2) | Package information | 2022-07-13 |
| pmcm4401vne-ssmos_fr | pmcm4401vne-ssmos_fr | Reflow soldering | 2015-07-10 |
| PMCM6501UNE_06_01_2017 | PMCM6501UNE SPICE model | SPICE model | 2017-10-21 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2025-09-10 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PMCM6501UNE_06_01_2017 | PMCM6501UNE SPICE model | SPICE model | 2017-10-21 |
| WLCSP6_3-2 | 3D model for products with WLCSP6_3-2 package | Design support | 2023-03-13 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.