可訂購(gòu)部件
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 訂購(gòu)代碼(12NC) | 封裝 | 從經(jīng)銷商處購(gòu)買 |
|---|---|---|---|---|
| PMEG3030BEP | PMEG3030BEP,115 | 934061476115 | SOD128 | 訂單產(chǎn)品 |
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Click here for more informationPMEG3030BEP
30 V, 3 A low VF Schottky barrier rectifier
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.
Alternatives
Features and benefits
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 30 V
Low forward voltage
High power capability due to clip-bond technology
Small and flat lead SMD plastic package
Suitable for both reflow and wave soldering
Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Reverse polarity protection
Low power consumption applications
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (A) | Nr of functions | Configuration | VF [typ] @25 C (mV) | VF [max] (mV) | IR [typ] @25 C (μA) | IR [max] @25 C (μA) | Cd [max] (pF) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG3030BEP | SOD128 | CFP5 | 3.8 x 2.5 x 1 | 30.0 | 3.0 | single | single | 400.0 | 450.0 | 9000.0 | 150.0 | 500.0 | N |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PMEG3030BEP | PMEG3030BEP,115 (934061476115) |
Active | A6 |
CFP5 (SOD128) |
SOD128 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOD128_115 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PMEG3030BEP | PMEG3030BEP,115 | PMEG3030BEP |
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文檔 (20)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PMEG3030BEP | 30 V, 3 A low VF Schottky barrier rectifier | Data sheet | 2023-02-20 |
| AN10808 | Thermal consideration of NXP FlatPower MEGA Schottky barrier rectifiers - Selection criteria | Application note | 2015-04-29 |
| AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
| Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
| SOD128_stepfile | SOD128 STEP file | Design support | 2025-06-12 |
| Leaflet_Clip-bond_Flat_Power_CFP_Strategy-CN | CFP封裝的肖特基整流器 | Leaflet | 2025-08-01 |
| Leaflet_Clip-bond_Flat_Power_CFP_Strategy-CN | CFP封裝的肖特基整流器 | Leaflet | 2025-08-01 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| CFP5_SOD128_mk | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOD128 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Package information | 2022-05-27 |
| SOD128_115 | Reel pack for SMD, 7''; Q1/T1-Q2/T3 product orientation | Packing information | 2020-06-11 |
| PMEG3030BEP_Nexperia_Product_Reliability | PMEG3030BEP Nexperia Product Reliability | Quality document | 2025-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PMEG3030BEP | PMEG3030BEP SPICE model | SPICE model | 2012-07-22 |
| PMEG3030BEP | PMEG3030BEP SPICE model | SPICE model | 2025-10-11 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PMEG3030BEP | PMEG3030BEP SPICE model | SPICE model | 2012-07-22 |
| PMEG3030BEP | PMEG3030BEP SPICE model | SPICE model | 2025-10-11 |
| SOD128_stepfile | SOD128 STEP file | Design support | 2025-06-12 |
訂購(gòu)、定價(jià)與供貨
| 型號(hào) | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購(gòu)買 |
|---|---|---|---|---|---|---|
| PMEG3030BEP | PMEG3030BEP,115 | 934061476115 | Active | SOD128_115 | 3,000 |
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樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機(jī)構(gòu)訂購(gòu)樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.