可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
|---|---|---|---|---|
| PMEG6030CELP | PMEG6030CELPX | 934669794115 | SOD128 | 訂單產(chǎn)品 |
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Click here for more informationPMEG6030CELP
60 V, 3 A low leakage current Schottky barrier rectifier
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.
Features and benefits
Extremely low leakage current
High power capability due to clip-bonding technology
High temperature Tj ≤ 175 °C
Small and flat lead SMD plastic package
Suitable for both reflow and wave soldering
Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Reverse polarity protection
Low power consumption applications
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (A) | Nr of functions | Configuration | VF [typ] @25 C (mV) | VF [max] (mV) | IR [typ] @25 C (μA) | IR [max] @25 C (μA) | Cd [max] (pF) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG6030CELP | SOD128 | CFP5 | 3.8 x 2.5 x 1 | 60 | 3 | single | single | 665 | 750 | 0.235 | 0.7 | 220 | N |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PMEG6030CELP | PMEG6030CELPX (934669794115) |
Active | GJ |
CFP5 (SOD128) |
SOD128 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOD128_115 |
文檔 (15)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PMEG6030CELP | 60 V, 3 A low leakage current Schottky barrier rectifier | Data sheet | 2025-03-10 |
| AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
| AN90063 | Questions about package outline drawings | Application note | 2025-09-15 |
| Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
| SOD128_stepfile | SOD128 STEP file | Design support | 2025-06-12 |
| Leaflet_Clip-bond_Flat_Power_CFP_Strategy-CN | CFP封裝的肖特基整流器 | Leaflet | 2025-08-01 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| CFP5_SOD128_mk | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOD128 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Package information | 2022-05-27 |
| SOD128_115 | Reel pack for SMD, 7''; Q1/T1-Q2/T3 product orientation | Packing information | 2020-06-11 |
| PMEG6030CELP_Nexperia_Product_Reliability | PMEG6030CELP Nexperia Product Reliability | Quality document | 2025-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PMEG6030CELP | PMEG6030CELP SPICE model | SPICE model | 2025-10-11 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PMEG6030CELP | PMEG6030CELP SPICE model | SPICE model | 2025-10-11 |
| SOD128_stepfile | SOD128 STEP file | Design support | 2025-06-12 |
訂購、定價與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| PMEG6030CELP | PMEG6030CELPX | 934669794115 | Active | SOD128_115 | 3,000 |
|
樣品
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.