可訂購(gòu)部件
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 訂購(gòu)代碼(12NC) | 封裝 | 從經(jīng)銷(xiāo)商處購(gòu)買(mǎi) |
|---|---|---|---|---|
| PSMN1R7-40YLB | PSMN1R7-40YLBX | 934665890115 | SOT669 | 訂單產(chǎn)品 |
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Click here for more informationPSMN1R7-40YLB
N-channel 40 V, 1.8 mOhm, 200 A logic level MOSFET in LFPAK56 using optimized NextPowerS3 Schottky-Plus technology
200 A, logic level gate drive N-channel enhancement mode MOSFET in 175 °C LFPAK56 package, using advanced TrenchMOS Superjunction technology with optimization to provide improved EMC performance (up to 6 dB). This product has been designed and qualified for high performance power switching applications.
Features and benefits
Optimized for improved EMC Performance
200 A continuous ID(max) rating
Avalanche rated, 100% tested at IAS = 180 A
Strong SOA (linear-mode) rating
NextPowerS3 technology delivers 'superfast switching with soft body-diode recovery'
Low Qrr, QG and QGD for high system efficiency and low EMI designs
Schottky-Plus body-diode with low VSD, low Qrr, soft recovery and low IDSS leakage
Optimized for 4.5 V gate drive utilizing NextPowerS3 Superjunction technology
High reliability LFPAK (Power SO8) package, with copper-clip and solder die attach, qualified to 175 °C
Exposed leads can be wave soldered, visual solder joint inspection and high quality solder joints providing excellent board level reliability
Low parasitic inductance and resistance
Applications
Automation, control and instrumentation
Autonomous systems, Robotics and Cobots
DC-to-DC converters
Brushless DC motor control
Brushed motors
Battery isolation
Industrial load-switch and eFuse
Inrush management, hotswap
參數(shù)類(lèi)型
| 型號(hào) | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN1R7‑40YLB | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 40 | 1.8 | 2.3 | 175 | 200 | 7.3 | 35 | 79 | 194 | 26 | 1.75 | N | 5813 | 1422 | 2023-10-24 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PSMN1R7‑40YLB | PSMN1R7‑40YLBX (934665890115) |
Active | 1B7L40Y |
LFPAK56; Power‑SO8 (SOT669) |
SOT669 |
WAVE_BG-BD-1
|
SOT669_115 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PSMN1R7‑40YLB | PSMN1R7‑40YLBX | PSMN1R7-40YLB |
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文檔 (24)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| PSMN1R7-40YLB | N-channel 40 V, 1.8 mOhm, 200 A logic level MOSFET in LFPAK56 using optimized NextPowerS3 Schottky-Plus technology | Data sheet | 2024-02-13 |
| AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2025-10-21 |
| AN11160 | Designing RC Snubbers | Application note | 2025-09-10 |
| AN11261 | RC Thermal Models | Application note | 2025-09-10 |
| AN50014 | Understanding the MOSFET peak drain current rating | Application note | 2025-09-08 |
| AN90003 | LFPAK MOSFET thermal design guide | Application note | 2025-09-30 |
| AN90011 | Half-bridge MOSFET switching and its impact on EMC | Application note | 2025-09-10 |
| AN90016 | Maximum continuous currents in NEXPERIA LFPAK power MOSFETs | Application note | 2025-09-08 |
| AN90034 | Nexperia Precision Electrothermal models in SPICE and VHDL-AMS for Power MOSFETs | Application note | 2025-09-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| LFPAK56_POWER-SO8_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| PSMN1R7-40YLB_V1_1 | PSMN1R7-40YLB Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2024-03-13 |
| SOT669 | plastic, single-ended surface-mounted package; 4 terminals | Package information | 2025-03-20 |
| SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
| T9_SOT669_PSMN1R7-40YLB_Nexperia_Quality_Reliability_document | T9_SOT669_PSMN1R7-40YLB_Nexperia_Quality_Reliability_document | Quality document | 2025-02-26 |
| PSMN1R7-40YLB | PSMN1R7-40YLB SPICE model | SPICE model | 2023-11-06 |
| CauerModel_PSMN1R7-40YLB | Cauer model PSMN1R7-40YLB | Thermal model | 2023-11-03 |
| FosterModel_PSMN1R7-40YLB | Foster model PSMN1R7-40YLB | Thermal model | 2023-11-03 |
| PSMN1R7-40YLB | PSMN1R7-40YLB RC thermal model | Thermal model | 2023-11-03 |
| PSMN1R7-40YLB_Cauer | PSMN1R7-40YLB Cauer model | Thermal model | 2023-11-03 |
| PSMN1R7-40YLB_Foster | PSMN1R7-40YLB Foster model | Thermal model | 2023-11-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| PSMN1R7-40YLB_V1_1 | PSMN1R7-40YLB Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2024-03-13 |
| PSMN1R7-40YLB | PSMN1R7-40YLB SPICE model | SPICE model | 2023-11-06 |
| CauerModel_PSMN1R7-40YLB | Cauer model PSMN1R7-40YLB | Thermal model | 2023-11-03 |
| FosterModel_PSMN1R7-40YLB | Foster model PSMN1R7-40YLB | Thermal model | 2023-11-03 |
| PSMN1R7-40YLB | PSMN1R7-40YLB RC thermal model | Thermal model | 2023-11-03 |
| PSMN1R7-40YLB_Cauer | PSMN1R7-40YLB Cauer model | Thermal model | 2023-11-03 |
| PSMN1R7-40YLB_Foster | PSMN1R7-40YLB Foster model | Thermal model | 2023-11-03 |
| SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
訂購(gòu)、定價(jià)與供貨
| 型號(hào) | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購(gòu)買(mǎi) |
|---|---|---|---|---|---|---|
| PSMN1R7‑40YLB | PSMN1R7‑40YLBX | 934665890115 | Active | SOT669_115 | 1,500 |
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樣品
作為 Nexperia 的客戶(hù)，您可以通過(guò)我們的銷(xiāo)售機(jī)構(gòu)訂購(gòu)樣品。
如果您沒(méi)有 Nexperia 的直接賬戶(hù)，我們的全球和地區(qū)分銷(xiāo)商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷(xiāo)商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.