74CBTLVD3245
8-bit level-shifting bus switch with output enable
The 74CBTLVD3245 is an 8-pole, single-throw bus switch. The device features a single output enable input (OE) that controls eight switch channels. The switches are disabled when OE is HIGH. Schmitt trigger action at control inputs makes the circuit tolerant of slower input rise and fall times. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Supply voltage range from 3.0 V to 3.6 V
High noise immunity
Complies with JEDEC standard:
JESD8-B/JESD36 (3.0 V to 3.6 V)
5 Ω switch connection between two ports
Rail to rail switching on data I/O ports
CMOS low power consumption
Latch-up performance exceeds 250 mA per JESD78B Class I level A
IOFF circuitry provides partial Power-down mode operation
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類型
| 型號 | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74CBTLVD3245BQ | 3.0?-?3.6 | 1.8 | CMOS/LVTTL | 7 | 400 | 8 | 0.2 | very low | -40~125 | 76 | 7.3 | 47 | DHVQFN20 |
| 74CBTLVD3245PW | 3.0?-?3.6 | 1.8 | CMOS/LVTTL | 7 | 400 | 8 | 0.2 | very low | -40~125 | 99 | 4.3 | 43.4 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74CBTLVD3245BQ | 74CBTLVD3245BQ,115 (935294103115) |
Active | TLVD3245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74CBTLVD3245PW | 74CBTLVD3245PW,118 (935294104118) |
Active | LVD3245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74CBTLVD3245BQ | 74CBTLVD3245BQ,115 | 74CBTLVD3245BQ |
|
|
| 74CBTLVD3245PW | 74CBTLVD3245PW,118 | 74CBTLVD3245PW |
|
|
文檔 (11)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74CBTLVD3245 | 8-bit level-shifting bus switch with output enable | Data sheet | 2024-06-24 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| cbtlvd3245 | 74CBTLVD3245 IBIS model | IBIS model | 2013-06-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| cbtlvd3245 | 74CBTLVD3245 IBIS model | IBIS model | 2013-06-13 |
Ordering, pricing & availability
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