74AHC273-Q100; 74AHCT273-Q100
Octal D-type flip-flop with reset; positive-edge trigger
The 74AHC273?-?Q100; 74AHCT273?-?Q100 is an octal positive?-?edge triggered D?-?type flip?-?flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding D inputs that meet the set?-?up and hold time requirements on the LOW?-?to?-?HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
Balanced propagation delays
All inputs have Schmitt-trigger actions
Ideal buffer for MOS microcontroller or memory
Common clock and master reset
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
Input levels:
For 74AHC273-Q100: CMOS level
For 74AHCT273-Q100: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC273BQ-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 4.2 | 165 | low | -40~125 | 78 | 9.1 | 50 | DHVQFN20 |
| 74AHC273D-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 4.2 | 165 | low | -40~125 | 85 | 27.3 | 61 | SO20 |
| 74AHC273PW-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 4.2 | 165 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
| 74AHCT273BQ-Q100 | 4.5?-?5.5 | TTL | ± 8 | 4 | 120 | low | -40~125 | 78 | 9.1 | 50 | DHVQFN20 |
| 74AHCT273D-Q100 | 4.5?-?5.5 | TTL | ± 8 | 4 | 120 | low | -40~125 | 85 | 27.3 | 61 | SO20 |
| 74AHCT273PW-Q100 | 4.5?-?5.5 | TTL | ± 8 | 4 | 120 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC273BQ-Q100 | 74AHC273BQ‑Q100X (935300187115) |
Active | AHC273 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHC273D-Q100 | 74AHC273D‑Q100J (935300188118) |
Active | 74AHC273D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHC273PW-Q100 | 74AHC273PW‑Q100J (935300189118) |
Active | AHC273 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74AHCT273BQ-Q100 | 74AHCT273BQ‑Q100X (935300205115) |
Active | AHCT273 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHCT273D-Q100 | 74AHCT273D‑Q100J (935300206118) |
Active | 74AHCT273D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHCT273PW-Q100 | 74AHCT273PW‑Q100J (935300207118) |
Active | AHCT273 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC273BQ-Q100 | 74AHC273BQ‑Q100X | 74AHC273BQ-Q100 |
|
|
| 74AHC273D-Q100 | 74AHC273D‑Q100J | 74AHC273D-Q100 |
|
|
| 74AHC273PW-Q100 | 74AHC273PW‑Q100J | 74AHC273PW-Q100 |
|
|
| 74AHCT273BQ-Q100 | 74AHCT273BQ‑Q100X | 74AHCT273BQ-Q100 |
|
|
| 74AHCT273D-Q100 | 74AHCT273D‑Q100J | 74AHCT273D-Q100 |
|
|
| 74AHCT273PW-Q100 | 74AHCT273PW‑Q100J | 74AHCT273PW-Q100 |
|
|
文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT273_Q100 | Octal D-type flip-flop with reset; positive-edge trigger | Data sheet | 2023-09-21 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc273 | ahc273 IBIS model | IBIS model | 2013-04-08 |
| ahct273 | ahct273 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc273 | ahc273 IBIS model | IBIS model | 2013-04-08 |
| ahct273 | ahct273 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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