74HC273-Q100; 74HCT273-Q100
Octal D-type flip-flop with reset; positive-edge trigger
The 74HC273-Q100; 74HCT273-Q100 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW?-?to?-?HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
Input levels:
For 74HC273-Q100: CMOS level
For 74HCT273-Q100: TTL level
Common clock and master reset
Eight positive edge-triggered D-type flip-flops
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC273BQ-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 15 | 122 | low | -40~125 | 78 | 9.4 | 50 | DHVQFN20 |
| 74HC273D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 15 | 122 | low | -40~125 | 85 | 27.5 | 61 | SO20 |
| 74HC273PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 15 | 122 | low | -40~125 | 100 | 4.6 | 44.9 | TSSOP20 |
| 74HCT273BQ-Q100 | 4.5?-?5.5 | TTL | ± 4 | 15 | 36 | low | -40~125 | 78 | 9.4 | 50 | DHVQFN20 |
| 74HCT273D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 15 | 36 | low | -40~125 | 85 | 27.5 | 61 | SO20 |
| 74HCT273PW-Q100 | 4.5?-?5.5 | TTL | ± 4 | 15 | 36 | low | -40~125 | 100 | 4.6 | 44.9 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC273BQ-Q100 | 74HC273BQ‑Q100X (935301457115) |
Active | HC273BQ |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HC273D-Q100 | 74HC273D‑Q100J (935301455118) |
Active | 74HC273D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HC273PW-Q100 | 74HC273PW‑Q100J (935301456118) |
Active | HC273 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74HCT273BQ-Q100 | 74HCT273BQ‑Q100X (935301461115) |
Active | HCT273BQ |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HCT273D-Q100 | 74HCT273D‑Q100J (935301458118) |
Active | 74HCT273D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HCT273PW-Q100 | 74HCT273PW‑Q100J (935301459118) |
Active | HCT273 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC273BQ-Q100 | 74HC273BQ‑Q100X | 74HC273BQ-Q100 |
|
|
| 74HC273D-Q100 | 74HC273D‑Q100J | 74HC273D-Q100 |
|
|
| 74HC273PW-Q100 | 74HC273PW‑Q100J | 74HC273PW-Q100 |
|
|
| 74HCT273BQ-Q100 | 74HCT273BQ‑Q100X | 74HCT273BQ-Q100 |
|
|
| 74HCT273D-Q100 | 74HCT273D‑Q100J | 74HCT273D-Q100 |
|
|
| 74HCT273PW-Q100 | 74HCT273PW‑Q100J | 74HCT273PW-Q100 |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT273_Q100 | Octal D-type flip-flop with reset; positive-edge trigger | Data sheet | 2024-08-05 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
Ordering, pricing & availability
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