可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經銷商處購買 |
|---|---|---|---|---|
| 74HC139PW-Q100 | 74HC139PW-Q100J | 935301197118 | SOT403-1 | 訂單產品 |
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Click here for more information74HC139PW-Q100
Dual 2-to-4 line decoder/demultiplexer
The 74HC139-Q100; 74HCT139-Q100 decodes two binary weighted address inputs (nA0, nA1) to four mutually exclusive outputs (nY0 to nY3). Each decoder features an enable input (nE). When nE is HIGH all outputs are forced HIGH. The enable input can be used as the data input for a 1?-?to?-?4 demultiplexer application. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Input levels:
For 74HC139-Q100: CMOS level
For 74HCT139-Q100: TTL level
Demultiplexing capability
2 independent 2-to-4 decoders
Multifunction capability
Suitable for memory decoding, data routing or code conversion
Complies with JEDEC standard no. 7A
Active LOW mutually exclusive outputs
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74HC139PW‑Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 14 | low | -40~125 | 124 | 4.4 | 53.8 | TSSOP16 |
PCB Symbol, Footprint and 3D Model
| Model Name | 描述 |
|---|---|
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封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC139PW‑Q100 | 74HC139PW‑Q100J (935301197118) |
Active | HC139 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
文檔 (11)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT139_Q100 | Dual 2-to-4 line decoder/demultiplexer | Data sheet | 2024-02-29 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| hc139 | 74HC139 IBIS model | IBIS model | 2020-08-14 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SOT403-1_118 | TSSOP16; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2020-04-21 |
| 74HC139PW-Q100_Nexperia_Product_Reliability | 74HC139PW-Q100 Nexperia Product Reliability | Quality document | 2025-03-20 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
PCB Symbol, Footprint and 3D Model
| Model Name | 描述 |
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訂購、定價與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| 74HC139PW‑Q100 | 74HC139PW‑Q100J | 935301197118 | Active | SOT403-1_118 | 2,500 |
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樣品
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.