74AHC138-Q100; 74AHCT138-Q100
3-to-8 line decoder/demultiplexer; inverting
The 74AHC138-Q100; 74AHCT138-Q100 are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard No. 7A.
The 74AHC138-Q100; 74AHCT138-Q100 is a 3-to-8 line decoder/demultiplexer. It accepts three binary weighted address inputs (A0, A1 and A2) and, when enabled, provides eight mutually exclusive outputs (Y0 to Y7) that are LOW when selected.
There are three enable inputs: two active LOW (E1 and E2) and one active HIGH (E3). Every output will be HIGH unless E1 and E2 are LOW and E3 is HIGH.
This multiple enable function allows easy parallel expansion of the device to a 1-of-32 (5 lines to 32 lines) decoder with just four 74AHC138-Q100; 74AHCT138-Q100 devices and one inverter. The 74AHC138-Q100; 74AHCT138-Q100 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Unused enable inputs must be permanently tied to their appropriate active HIGH or LOW state.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Balanced propagation delays
All inputs have Schmitt-trigger action
Demultiplexing capability
Multiple input enable for easy expansion
Ideal for memory chip select decoding
Inputs accepts voltages higher than VCC
For 74AHC138-Q100 only: operates with CMOS input levels
For 74AHCT138-Q100 only: operates with TTL input levels
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類(lèi)型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC138BQ-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | low | -40~125 | 93 | 13.8 | 62 | DHVQFN16 |
| 74AHC138D-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | low | -40~125 | 93 | 9.7 | 52 | SO16 |
| 74AHC138PW-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | low | -40~125 | 125 | 4.6 | 54.7 | TSSOP16 |
| 74AHCT138BQ-Q100 | 4.5?-?5.5 | TTL | ± 8 | 4.4 | low | -40~125 | 93 | 13.8 | 62 | DHVQFN16 |
| 74AHCT138D-Q100 | 4.5?-?5.5 | TTL | ± 8 | 4.4 | low | -40~125 | 93 | 9.7 | 52 | SO16 |
| 74AHCT138PW-Q100 | 4.5?-?5.5 | TTL | ± 8 | 4.4 | low | -40~125 | 125 | 4.6 | 54.7 | TSSOP16 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC138BQ-Q100 | 74AHC138BQ‑Q100X (935300181115) |
Active | AHC138 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74AHC138D-Q100 | 74AHC138D‑Q100J (935300182118) |
Active | 74AHC138D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74AHC138PW-Q100 | 74AHC138PW‑Q100J (935300183118) |
Active | AHC138 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74AHCT138BQ-Q100 | 74AHCT138BQ‑Q100X (935300198115) |
Active | AHT138 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74AHCT138D-Q100 | 74AHCT138D‑Q100J (935300199118) |
Active | 74AHCT138D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74AHCT138PW-Q100 | 74AHCT138PW‑Q100J (935300201118) |
Active | AHCT138 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC138BQ-Q100 | 74AHC138BQ‑Q100X | 74AHC138BQ-Q100 |
|
|
| 74AHC138D-Q100 | 74AHC138D‑Q100J | 74AHC138D-Q100 |
|
|
| 74AHC138PW-Q100 | 74AHC138PW‑Q100J | 74AHC138PW-Q100 |
|
|
| 74AHCT138BQ-Q100 | 74AHCT138BQ‑Q100X | 74AHCT138BQ-Q100 |
|
|
| 74AHCT138D-Q100 | 74AHCT138D‑Q100J | 74AHCT138D-Q100 |
|
|
| 74AHCT138PW-Q100 | 74AHCT138PW‑Q100J | 74AHCT138PW-Q100 |
|
|
文檔 (18)
| 文件名稱 | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT138_Q100 | 3-to-8 line decoder/demultiplexer; inverting | Data sheet | 2024-02-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| ahc138 | ahc138 IBIS model | IBIS model | 2013-04-08 |
| ahct138 | ahct138 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| ahc138 | ahc138 IBIS model | IBIS model | 2013-04-08 |
| ahct138 | ahct138 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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