可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
|---|---|---|---|---|
| PMEG060T050ELPE | PMEG060T050ELPEZ | 934661523139 | SOT1289B | 訂單產(chǎn)品 |
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Click here for more informationPMEG060T050ELPE
60 V, 5 A low leakage current Trench Schottky barrier rectifier
Trench Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package.
Alternatives
Features and benefits
Average forward current: IF(AV) ≤ 5 A
Reverse voltage: VR ≤ 60 V
Low forward voltage
Low leakage current due to Trench Schottky technology
High power capability due to clip-bonding technology
Small and flat lead SMD power plastic package
Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Freewheeling application
Reverse polarity protection
Low power consumption application
Low voltage, high frequency inverters
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | VR [max] (V) | IF(AV) per diode; [max] (A) | Nr of functions | Configuration | VF [max] (mV) | IR [max] (μA) | Cd [max] (pF) | Remark | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG060T050ELPE | SOT1289B | CFP15B | 5.8 x 4.3 x 0.95 | 60.0 | 5.0 | single | single | 690.0 | 1.8 | 560.0 | Trench technology | N |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PMEG060T050ELPE | PMEG060T050ELPEZ (934661523139) |
Active | 060T M05E |
CFP15B (SOT1289B) |
SOT1289B |
WAVE_BG-BD-1
|
SOT1289B_139 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PMEG060T050ELPE | PMEG060T050ELPEZ | PMEG060T050ELPE |
|
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文檔 (11)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PMEG060T050ELPE | 60 V, 5 A low leakage current Trench Schottky barrier rectifier | Data sheet | 2024-07-15 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT1289B | 3D model for products with SOT1289B package | Design support | 2020-01-22 |
| RS2624_CFP15BSide | RS2624_CFP15BSide | Marcom graphics | 2021-03-11 |
| SOT1289B | plastic, thermal enhanced ultra thin SMD package; 3leads; 2.13?mm pitch; 5.8 x 4.3 x 0.95 mm body | Package information | 2023-06-02 |
| SOT1289B_139 | CFP15B; Reel pack for SMD, 13"; Q4/T2 product orientation | Packing information | 2020-09-02 |
| PMEG060T050ELPE_Nexperia_Product_Reliability | PMEG060T050ELPE Nexperia Product Reliability | Quality document | 2025-05-27 |
| PMEG060T050ELPE | PMEG060T050ELPE SPICE model | SPICE model | 2020-01-14 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PMEG060T050ELPE | PMEG060T050ELPE SPICE model | SPICE model | 2020-01-14 |
| SOT1289B | 3D model for products with SOT1289B package | Design support | 2020-01-22 |
訂購、定價與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| PMEG060T050ELPE | PMEG060T050ELPEZ | 934661523139 | Active | SOT1289B_139 | 5,000 |
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樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.