74AHC574; 74AHCT574
Octal D-type flip-flop; positive edge-trigger; 3-state
The 74AHC574; 74AHCT574 is an 8?-?bit positive?-?edge triggered D?-?type flip?-?flop with 3?-?state outputs. The device features a clock (CP) and output enable (OE) inputs. The flip?-?flops will store the state of their individual D?-?inputs that meet the set?-?up and hold time requirements on the LOW?-?to?-?HIGH clock (CP) transition. A HIGH on OE causes the outputs to assume a high?-?impedance OFF?-?state. Operation of the OE input does not affect the state of the flip?-?flops. Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments.
Features and benefits
Wide supply voltage range:
For 74AHC574: from 2.0 V to 5.5 V
For 74AHCT574: from 4.5 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
Balanced propagation delays
All inputs have a Schmitt-trigger action
High noise immunity
3-state non-inverting outputs for bus orientated applications
CMOS low power dissipation
Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
Input levels:
For 74AHC574: CMOS input level
For 74AHCT574: TTL input level
- ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC574BQ | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | 130 | low | -40~125 | 77 | 8.1 | 48 | DHVQFN20 |
| 74AHC574D | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | 130 | low | -40~125 | 84 | 26.4 | 60 | SO20 |
| 74AHC574PW | 2.0?-?5.5 | CMOS | ± 8 | 4.4 | 130 | low | -40~125 | 100 | 4.4 | 44 | TSSOP20 |
| 74AHCT574BQ | 4.5?-?5.5 | TTL | ± 8 | 4.4 | 130 | low | -40~125 | 77 | 8.1 | 48 | DHVQFN20 |
| 74AHCT574D | 4.5?-?5.5 | TTL | ± 8 | 4.4 | 130 | low | -40~125 | 84 | 26.4 | 60 | SO20 |
| 74AHCT574PW | 4.5?-?5.5 | TTL | ± 8 | 4.4 | 130 | low | -40~125 | 100 | 4.4 | 44 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC574BQ | 74AHC574BQ,115 (935285546115) |
Active | AHC574 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHC574D | 74AHC574D,118 (935263080118) |
Active | 74AHC574D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHC574PW | 74AHC574PW,118 (935263081118) |
Active | AHC574 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74AHCT574BQ | 74AHCT574BQ,115 (935285549115) |
Active | AHCT574 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHCT574D | 74AHCT574D,118 (935263082118) |
Active | 74AHCT574D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHCT574PW | 74AHCT574PW,118 (935263083118) |
Active | AHCT574 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC574BQ | 74AHC574BQ,115 | 74AHC574BQ |
|
|
| 74AHC574D | 74AHC574D,118 | 74AHC574D |
|
|
| 74AHC574PW | 74AHC574PW,118 | 74AHC574PW |
|
|
| 74AHCT574BQ | 74AHCT574BQ,115 | 74AHCT574BQ |
|
|
| 74AHCT574D | 74AHCT574D,118 | 74AHCT574D |
|
|
| 74AHCT574PW | 74AHCT574PW,118 | 74AHCT574PW |
|
|
文檔 (16)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT574 | Octal D-type flip-flop; positive edge-trigger; 3-state | Data sheet | 2023-09-06 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| 001aah077 | Block diagram: 74AHC574BQ, 74AHC574D, 74AHC574PW, 74AHCT574BQ, 74AHCT574D, 74AHCT574PW | Block diagram | 2009-11-03 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc574 | ahc574 IBIS model | IBIS model | 2013-04-08 |
| ahct574 | ahct574 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc574 | ahc574 IBIS model | IBIS model | 2013-04-08 |
| ahct574 | ahct574 IBIS model | IBIS model | 2013-04-08 |
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