74ALVCH16501
18-bit universal bus transceiver; 3-state
The 74ALVCH16501 is an 18-bit universal transceiver with bus hold inputs and 3-state outputs. Data flow in each direction is controlled by output enable (OEAB and OEBA), latch enable (LEAB and LEBA), and clock (CPAB and CPBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is HIGH. When LEAB is LOW, the A data is latched if CPAB is held at a HIGH or LOW logic level. If LEAB is LOW, the A-bus data is stored in the latch/flip-flop on the LOW-to-HIGH transition of CPAB. When OEAB is HIGH, the outputs are active. When OEAB is LOW, the outputs are in the high-impedance state. Data flow for B-to-A is similar to that of A-to-B but uses OEBA, LEBA and CPBA. The output enables are complimentary (OEAB is active HIGH and OEBA is active LOW). This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power dissipation
Direct interface with TTL levels
Current drive ±24 mA at VCC = 3.0 V
Universal bus transceiver with D-type latches and D-type flip-flops capable of operating in transparent, latched or clocked mode
Bus hold on all data inputs
Output drive capability 50 Ω transmission lines at 85 °C
3-state non-inverting outputs for bus-oriented applications
Latch-up performance exceeds 100 mA per JESD78 Class II.A
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Complies with JEDEC standards:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C/JESD36 (2.7 V to 3.6 V)
-
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74ALVCH16501DGG | n.a. | n.a. | TTL | ± 24 | 2.8 | 18 | 150 | low | -40~85 | 93 | TSSOP56 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ALVCH16501DGG | 74ALVCH16501DGG,11 (935262543118) |
Active | ALVCH16501 |
TSSOP56 (SOT364-1) |
SOT364-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT364-1_118 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ALVCH16501DGG | 74ALVCH16501DGGY (935262543518) |
Withdrawn / End-of-life | ALVCH16501 |
TSSOP56 (SOT364-1) |
SOT364-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
| 74ALVCH16501DL | 74ALVCH16501DL,112 (935263882112) |
Obsolete | ALVCH16501 Standard Procedure Standard Procedure |
SSOP56 (SOT371-1) |
SOT371-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| 74ALVCH16501DL,118 (935263882118) |
Obsolete | ALVCH16501 Standard Procedure Standard Procedure | 暫無信息 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ALVCH16501DGG | 74ALVCH16501DGG,11 | 74ALVCH16501DGG |
|
|
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ALVCH16501DGG | 74ALVCH16501DGGY | 74ALVCH16501DGG |
|
|
| 74ALVCH16501DL | 74ALVCH16501DL,112 | 74ALVCH16501DL |
|
|
| 74ALVCH16501DL | 74ALVCH16501DL,118 | 74ALVCH16501DL |
|
|
文檔 (10)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74ALVCH16501 | 18-bit universal bus transceiver; 3-state | Data sheet | 2024-07-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| sw00091 | Block diagram: 74ALVCH16501DGG | Block diagram | 2009-11-03 |
| SOT364-1 | 3D model for products with SOT364-1 package | Design support | 2020-01-22 |
| alvch16501 | alvch16501 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT364-1 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | Package information | 2022-06-23 |
| SOT371-1 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT364-1 | 3D model for products with SOT364-1 package | Design support | 2020-01-22 |
| alvch16501 | alvch16501 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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