74HC299
8-bit universal shift register; 3-state
The 74HC299 is an 8?-?bit universal shift register with 3?-?state outputs. It contains eight edge?-?triggered D?-?type flip?-?flops and the interstage logic necessary to perform synchronous shift?-?right, shift?-?left, parallel load and hold operations. The type of operation is determined by the mode select inputs S0 and S1. Pins I/O0 to I/O7 are flip?-?flop 3?-?state buffer outputs which allow them to operate as data inputs in parallel load mode. The serial outputs Q0 and Q7 are used for expansion in serial shifting of longer words. A LOW signal on the asynchronous master reset input MR overrides the Sn and clock CP inputs and resets the flip?-?flops. All other state changes are initiated by the rising edge of the clock pulse. Inputs can change when the clock is either state, provided that the recommended set?-?up and hold times are observed. A HIGH signal on the 3?-?state output enable inputs OE1 or OE2 disables the 3?-?state buffers and the I/On outputs assume a high?-?impedance OFF?-?state. In this condition, the shift, hold, load and reset operations can still occur. The 3?-?state buffers are also disabled by HIGH signals on both S0 and S1, when in preparation for a parallel load operation. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Features and benefits
CMOS input levels
Multiplexed inputs/outputs provide improved bit density
Four operating modes:
Shift left
Shift right
Hold (store)
Load data
Operates with output enable or at high-impedance OFF-state
3-state outputs drive bus lines directly
Cascadable for n-bit word lengths
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC299D | 2.0?-?6.0 | CMOS | ± 7.8 | 19 | 54 | 8 | low | -40~125 | 63 | 6 | 38 | SO20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC299D | 74HC299D,653 (933713540653) |
Active | 74HC299D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暫無信息 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC299DB | 74HC299DB,112 (935189890112) |
Obsolete | no package information | ||||
| 74HC299DB,118 (935189890118) |
Obsolete | ||||||
| 74HC299PW | 74HC299PW,112 (935286924112) |
Obsolete | HC299 Standard Procedure Standard Procedure |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
| 74HC299PW,118 (935286924118) |
Obsolete | HC299 Standard Procedure Standard Procedure | SOT360-1_118 | ||||
文檔 (13)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74HC299 | 8-bit universal shift register; 3-state | Data sheet | 2024-08-05 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| 001aai461 | Block diagram: 74HC299D, 74HC299DB, 74HC299N, 74HC299PW, 74HCT299D, 74HCT299DB, 74HCT299N, 74HCT299PW | Block diagram | 2009-11-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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