74AVC1T1004
1-to-4 fan-out buffer
The 74AVC1T1004 is a translating 1-to-4 fan-out buffer suitable for use in clock distribution. It has dual supplies (VCC(A) and VCC(B)) for voltage translation. It also has a data input (A), four data outputs (Yn) and an output enable input (OE). VCC(A) and VCC(B) can be independently supplied at any voltage between 0.8 V and 3.6 V. It makes the device suitable for low voltage translation between any of the following voltages: 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V. The levels of A and OE are referenced to VCC(A), outputs Yn are referenced to VCC(B). This supply configuration ensures that the fanned out signals can be used in level shifting. A HIGH on OE causes all outputs to be pulled LOW via pull-down resistors, a LOW on OE disconnects the pull-down resistors and enables all outputs.
Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time.
The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range:
VCC(A): 0.8 V to 3.6 V
VCC(B): 0.8 V to 3.6 V
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
Maximum data rates:
380 Mbit/s (≥ 1.8 V to 3.3 V translation)
200 Mbit/s (≥ 1.1 V to 3.3 V translation)
200 Mbit/s (≥ 1.1 V to 2.5 V translation)
200 Mbit/s (≥ 1.1 V to 1.8 V translation)
150 Mbit/s (≥ 1.1 V to 1.5 V translation)
100 Mbit/s (≥ 1.1 V to 1.2 V translation)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74AVC1T1004DP | n.a. | CMOS/LVTTL | ± 12 | 1 | very low | -40~125 | 188 | 23.9 | 96.8 | TSSOP10 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AVC1T1004DP | 74AVC1T1004DPJ (935690122118) |
Active | Bc |
TSSOP10 (SOT552-1) |
SOT552-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT552-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AVC1T1004GU33 | 74AVC1T1004GU33Z (935690126471) |
Obsolete | no package information | ||||
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AVC1T1004DP | 74AVC1T1004DPJ | 74AVC1T1004DP |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AVC1T1004GU33 | 74AVC1T1004GU33Z | 74AVC1T1004GU33 |
|
|
文檔 (9)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AVC1T1004 | 1-to-4 fan-out buffer | Data sheet | 2024-06-25 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT552-1 | 3D model for products with SOT552-1 package | Design support | 2020-01-22 |
| avc1t1004 | 74AVC1T1004 IBIS model | IBIS model | 2018-06-18 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP10_SOT552_mk | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT552-1 | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2025-03-19 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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