74AHCV17A
Hex buffer Schmitt trigger
The 74AHCV17A is a hex buffer with Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.8 V to 5.5 V
Typical tpd of 3.2 ns at 5 V
Typical VOL(p) < 0.8 V at VCC = 3.3 V, Tamb = 25 °C
Typical VOH(v) > 2.3 V at VCC = 3.3 V, Tamb = 25 °C
Supports mixed-mode voltage operation on all ports
IOFF circuitry provides partial Power-down mode operation
Latch-up performance exceeds 250 mA per JESD 78 Class II
- ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 3000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 2000 V
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHCV17APW | 1.8?-?5.5 | CMOS | ± 16 | 60 | 6 | low | -40~125 | 143 | 7.9 | 69 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHCV17APW | 74AHCV17APWJ (935330431118) |
Active | AHCV17A |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
文檔 (8)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHCV17A | Hex buffer Schmitt trigger | Data sheet | 2024-01-23 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahcv17a | ahcv17a IBIS model | IBIS model | 2017-06-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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