NXB0108-Q100
Dual supply translating transceiver; auto direction sensing; 3-state
The NXB0108-Q100 is an 8-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 8-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.2 V and 3.6 V and VCC(B) can be supplied at any voltage between 1.65 V and 5.5 V, making the device suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V).
Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range:
VCC(A): 1.2 V to 3.6 V and VCC(B): 1.65 V to 5.5 V
IOFF circuitry provides partial Power-down mode operation
Inputs accept voltages up to 5.5 V
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port
HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V
Latch-up performance exceeds 100 mA per JESD 78B Class II
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
參數類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXB0108BQ-Q100 | 1.2?-?3.6 | 1.65?-?5.5 | CMOS | ± 0.02 | 5.5 | 8 | low | -40~125 | 94 | 10.7 | 61 | DHVQFN20 | Bi-directional | AutoSense |
| NXB0108PW-Q100 | 1.2?-?3.6 | 1.65?-?5.5 | CMOS | ± 0.02 | 5.5 | 8 | low | -40~125 | 92 | 2.3 | 35 | TSSOP20 | Bi-directional | AutoSense |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXB0108BQ-Q100 | NXB0108BQ‑Q100X (935691054115) |
Active | NXB0108B |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| NXB0108PW-Q100 | NXB0108PW‑Q100J (935691052118) |
Active | NXB0108 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NXB0108BQ-Q100 | NXB0108BQ‑Q100X | NXB0108BQ-Q100 |
|
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| NXB0108PW-Q100 | NXB0108PW‑Q100J | NXB0108PW-Q100 |
|
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文檔 (11)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| NXB0108_Q100 | Dual supply translating transceiver; auto direction sensing; 3?-?state | Data sheet | 2024-07-31 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| nxb0108 | NXB0108 IBIS model | IBIS model | 2020-10-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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