74HC240-Q100; 74HCT240-Q100
Octal buffer/line driver; 3-state; inverting
The 74HC240-Q100; 74HCT240-Q100 is a high-speed Si-gate CMOS device and is pin compatible with Low-Power Schottky TTL (LSTTL).
The 74HC240-Q100; 74HCT240-Q100 is a dual octal inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high impedance OFF-state.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
Inverting 3-state outputs
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC240BQ-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | 78 | 9.2 | 50 | DHVQFN20 |
| 74HC240D-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | 85 | 27.4 | 61 | SO20 |
| 74HC240PW-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 36 | 8 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
| 74HCT240BQ-Q100 | 4.5?-?5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | 78 | 9.2 | 50 | DHVQFN20 |
| 74HCT240D-Q100 | 4.5?-?5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | 85 | 27.4 | 61 | SO20 |
| 74HCT240PW-Q100 | 4.5?-?5.5 | TTL | ± 6 | 36 | 8 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC240BQ-Q100 | 74HC240BQ‑Q100,115 (935298786115) |
Active | HC240BQ |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HC240D-Q100 | 74HC240D‑Q100,118 (935298787118) |
Active | 74HC240D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HC240PW-Q100 | 74HC240PW‑Q100,118 (935298788118) |
Active | HC240 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74HCT240BQ-Q100 | 74HCT240BQ‑Q100,11 (935298789115) |
Active | HCT240 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HCT240D-Q100 | 74HCT240D‑Q100,118 (935298791118) |
Active | 74HCT240D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HCT240PW-Q100 | 74HCT240PW‑Q100,11 (935298792118) |
Active | HCT240 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC240BQ-Q100 | 74HC240BQ‑Q100,115 | 74HC240BQ-Q100 |
|
|
| 74HC240D-Q100 | 74HC240D‑Q100,118 | 74HC240D-Q100 |
|
|
| 74HC240PW-Q100 | 74HC240PW‑Q100,118 | 74HC240PW-Q100 |
|
|
| 74HCT240BQ-Q100 | 74HCT240BQ‑Q100,11 | 74HCT240BQ-Q100 |
|
|
| 74HCT240D-Q100 | 74HCT240D‑Q100,118 | 74HCT240D-Q100 |
|
|
| 74HCT240PW-Q100 | 74HCT240PW‑Q100,11 | 74HCT240PW-Q100 |
|
|
文檔 (16)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT240_Q100 | Octal buffer/line driver; 3-state; inverting | Data sheet | 2024-08-05 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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