BC56XPAS-Q series
80 V, 1 A NPN medium power transistors
NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
Features and benefits
High collector current capability IC and ICM
Reduced Printed-Circuit Board (PCB) area requirements
Exposed heat sink for excellent thermal and electrical conductivity
Two current gain selections
Leadless very small SMD plastic package with medium power capability
Suitable for Automatic Optical Inspection (AOI) of solder joint
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
Linear voltage regulators
Battery driven devices
MOSFET drivers
High-side switches
Power management
Amplifiers
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) |
|---|---|---|---|
| BC56-10PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 |
| BC56-16PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 |
| BC56PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC56-10PAS-Q | BC56‑10PAS‑QX (934668015115) |
Active | CL |
DFN2020D‑3 (SOT1061D) |
SOT1061D | SOT1061D_115 | |
| BC56-16PAS-Q | BC56‑16PAS‑QX (934668014115) |
Active | CM |
DFN2020D‑3 (SOT1061D) |
SOT1061D | SOT1061D_115 | |
| BC56PAS-Q | BC56PAS‑QX (934668016115) |
Active | CK |
DFN2020D‑3 (SOT1061D) |
SOT1061D | SOT1061D_115 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BC56-10PAS-Q | BC56‑10PAS‑QX | BC56-10PAS-Q |
|
|
| BC56-16PAS-Q | BC56‑16PAS‑QX | BC56-16PAS-Q |
|
|
| BC56PAS-Q | BC56PAS‑QX | BC56PAS-Q |
|
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文檔 (10)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| BC56XPAS-Q_SER | 80 V, 1 A NPN medium power transistors | Data sheet | 2024-05-28 |
| AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
| AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧輕便的汽車 二極管和晶體管 | Brochure | 2022-04-26 |
| SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
| Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
Ordering, pricing & availability
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