BC857xMB series
45 V, 100 mA PNP general-purpose transistors
PNP general-purpose transistors in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package.
Features and benefits
Leadless ultra small SMD plastic package
Power dissipation comparable to SOT23
Low package height of 0.37 mm
AEC-Q101 qualified
Applications
General-purpose switching and amplification
Mobile applications
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | Ptot (mW) | VCEO [max] (V) | VCEO [max] (V) | IC [max] (mA) | IC [max] (mA) | hFE [min] | hFE [min] | hFE [max] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857AMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250.0 | 250 | -45 | -45.0 | -100 | -100.0 | 125.0 | 125 | 250.0 | 250 | 150 | 100.0 | 100 | Y |
| BC857BMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250 | -45 | -100 | 220 | 475 | 150 | 100 | Y | ||||||
| BC857CMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250 | -45 | -100 | 420 | 800 | 150 | 100 | Y |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC857AMB | BC857AMB,315 (934065888315) |
Active | 0100 0100 |
DFN1006B‑3 (SOT883B) |
SOT883B | SOT883B_315 | |
| BC857BMB | BC857BMB,315 (934065889315) |
Active | 0100 0101 |
DFN1006B‑3 (SOT883B) |
SOT883B | SOT883B_315 | |
| BC857CMB | BC857CMB,315 (934065891315) |
Active | 0100 0110 |
DFN1006B‑3 (SOT883B) |
SOT883B | SOT883B_315 |
文檔 (6)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BC857XMB_SER | 45 V, 100 mA PNP general-purpose transistors | Data sheet | 2018-08-28 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT883B | 3D model for products with SOT883B package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1006B-3_SOT883B_mk | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1 mm x 0.6 mm x 0.37 mm body | Marcom graphics | 2017-01-28 |
| SOT883B | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1.0 mm x 0.6 mm x 0.37 mm body | Package information | 2022-05-20 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT883B | 3D model for products with SOT883B package | Design support | 2020-01-22 |
樣品
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