74AHC1G07-Q100
Buffer with open-drain output
The 74AHC1G07-Q100 is a single buffer with open-drain output. Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC1G07GV-Q100 | 2.0?-?5.5 | CMOS | 8 | 60 | 1 | low | -40~125 | 274 | 66.1 | 172 | TSOP5 |
| 74AHC1G07GW-Q100 | 2.0?-?5.5 | CMOS | 8 | 60 | 1 | low | -40~125 | 322 | 90.7 | 191 | TSSOP5 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC1G07GV-Q100 | 74AHC1G07GV‑Q100H (935305305125) |
Active | A07 |
TSOP5 (SOT753) |
SOT753 |
WAVE_BG-BD-1
|
SOT753_125 |
| 74AHC1G07GW-Q100 | 74AHC1G07GW‑Q100H (935305306125) |
Active | AS |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC1G07GV-Q100 | 74AHC1G07GV‑Q100H | 74AHC1G07GV-Q100 |
|
|
| 74AHC1G07GW-Q100 | 74AHC1G07GW‑Q100H | 74AHC1G07GW-Q100 |
|
|
文檔 (13)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC1G07_Q100 | Buffer with open-drain output | Data sheet | 2025-03-14 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| ahc1g07 | ahc1g07 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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Ordering, pricing & availability
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