74AXP1T14
Dual supply Schmitt trigger inverter
The 74AXP1T14 is a dual supply Schmitt trigger inverter. It features one input (A), an output (Y) and dual supply pins (VCCI and VCCO). The input is referenced to VCCI and the output is referenced to VCCO. Input A can be connected directly to VCCI or GND. VCCI can be supplied at any voltage between 0.7 V and 2.75 V and VCCO can be supplied at any voltage between 1.2 V and 5.5 V. This feature allows voltage level translation.
This device ensures very low static and dynamic power consumption across the entire supply range and is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range:
VCCI: 0.7 V to 2.75 V
VCCO: 1.2 V to 5.5 V
Low input capacitance; CI = 0.6 pF (typical)
Low output capacitance; CO = 1.8 pF (typical)
Low dynamic power consumption; CPD = 0.5 pF at VCCI = 1.2 V (typical)
Low dynamic power consumption; CPD = 7.1 pF at VCCO = 3.3 V (typical)
Low static power consumption; ICCI = 0.5 μA (85 °C maximum)
Low static power consumption; ICCO = 1.8 μA (85 °C maximum)
High noise immunity
Complies with JEDEC standard:
JESD8-12A.01 (1.1 V to 1.3 V; A input)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
JESD8-C (2.7 V to 3.6 V; Y output)
JESD12-6 (4.5 V to 5.5 V; Y output)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2000 V
CDM JESD22-C101E exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD78D Class II
Inputs accept voltages up to 2.75 V
Low noise overshoot and undershoot < 10% of VCCO
IOFF circuitry provides partial power-down mode operation
Specified from -40 °C to +85 °C
參數(shù)類型
| 型號(hào) |
|---|
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AXP1T14GW | 74AXP1T14GWH (935308974125) |
Withdrawn / End-of-life |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 | |
| 74AXP1T14GX | 74AXP1T14GXH (935308975125) |
Withdrawn / End-of-life |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 | ||
| 74AXP1T14GXZ (935308975147) |
Obsolete | 暫無信息 |
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AXP1T14GW | 74AXP1T14GWH | 74AXP1T14GW |
|
|
| 74AXP1T14GX | 74AXP1T14GXH | 74AXP1T14GX |
|
|
| 74AXP1T14GX | 74AXP1T14GXZ | 74AXP1T14GX |
|
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文檔 (14)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AXP1T14 | Dual supply Schmitt trigger inverter | Data sheet | 2022-02-02 |
| AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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