74LVC163
Presettable synchronous 4-bit binary counter; synchronous reset
The 74LVC163 is a synchronous presettable binary counter which features an internal look-ahead carry and can be used for high-speed counting. Synchronous operation is provided by having all flip-flops clocked simultaneously on the positive-going edge of the clock (pin CP). The outputs (pins Q0 to Q3) of the counters may be preset to a HIGH-level or LOW-level. A LOW-level at the parallel enable input (pin PE) disables the counting action and causes the data at the data inputs (pins D0 to D3) to be loaded into the counter on the positive-going edge of the clock (provided that the set-up and hold time requirements for PE are met). Preset takes place regardless of the levels at count enable inputs (pin CEP and CET). A LOW-level at the master reset input (pin MR) sets all four outputs of the flip-flops (pins Q0 to Q3) to LOW-level after the next positive-going transition on the clock input (pin CP) (provided that the set-up and hold time requirements for PE are met). This action occurs regardless of the levels at input pins PE, CET and CEP. This synchronous reset feature enables the designer to modify the maximum count with only one external NAND gate.
The look-ahead carry simplifies serial cascading of the counters. Both count enable inputs (pin CEP and CET) must be HIGH in count. The CET input is fed forward to enable the terminal count output (pin TC). The TC output thus enabled will produce a HIGH output pulse of a duration approximately equal to a HIGH-level output of Q0. This pulse can be used to enable the next cascaded stage.
The maximum clock frequency for the cascaded counters is determined by tPHL (propagation delay CP to TC) and tsu (set-up time CEP to CP) according to the formula: .
Features and benefits
Wide supply voltage range from 1.2 V to 3.6 V
Inputs accept voltages up to 5.5 V
CMOS low power consumption
Direct interface with TTL levels
Synchronous reset
Synchronous counting and loading
Two count enable inputs for n-bit cascading
Positive edge-triggered clock
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to 125 °C
參數(shù)類型
| 型號(hào) | VCC (V) | Output drive capability (mA) | Logic switching levels | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC163BQ | 1.2?-?3.6 | ± 24 | CMOS/LVTTL | 4.9 | low | -40~125 | 93 | 13.8 | 62 | DHVQFN16 |
| 74LVC163D | 1.2?-?3.6 | ± 24 | CMOS/LVTTL | 4.9 | low | -40~125 | 92 | 9.6 | 51.7 | SO16 |
| 74LVC163PW | 1.2?-?3.6 | ± 24 | CMOS/LVTTL | 4.9 | low | -40~125 | 125 | 4.6 | 54.7 | TSSOP16 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC163BQ | 74LVC163BQ,115 (935275615115) |
Active | LVC163 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74LVC163D | 74LVC163D,118 (935210540118) |
Active | 74LVC163D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74LVC163PW | 74LVC163PW,118 (935210560118) |
Active | LVC163 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC163DB | 74LVC163DB,112 (935210550112) |
Obsolete | LVC163 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| 74LVC163DB,118 (935210550118) |
Obsolete | LVC163 | 暫無信息 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC163BQ | 74LVC163BQ,115 | 74LVC163BQ |
|
|
| 74LVC163D | 74LVC163D,118 | 74LVC163D |
|
|
| 74LVC163PW | 74LVC163PW,118 | 74LVC163PW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC163DB | 74LVC163DB,112 | 74LVC163DB |
|
|
| 74LVC163DB | 74LVC163DB,118 | 74LVC163DB |
|
|
文檔 (24)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC163 | Presettable synchronous 4-bit binary counter; synchronous reset | Data sheet | 2024-02-12 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| mgu758 | Block diagram: 74LVC163BQ, 74LVC163D, 74LVC163DB, 74LVC163PW | Block diagram | 2009-11-04 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc163 | lvc163 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc163 | lvc163 IBIS model | IBIS model | 2013-04-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
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