74LVC595A
8-bit serial-in/serial-out or parallel-out shift register; 3-state
The 74LVC595A is an 8-bit serial-in/serial or parallel-out shift register with a storage register and 3?-?state outputs. Both the shift and storage register have separate clocks. The device features a serial input (DS) and a serial output (Q7S) to enable cascading and an asynchronous reset MR input. A LOW on MR will reset the shift register. Data is shifted on the LOW-to-HIGH transitions of the SHCP input. The data in the shift register is transferred to the storage register on a LOW?-?to?-?HIGH transition of the STCP input. If both clocks are connected together, the shift register will always be one clock pulse ahead of the storage register. Data in the storage register appears at the output whenever the output enable input (OE) is LOW. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the registers. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.2 V to 3.6 V
Overvoltage tolerant inputs to 5.5 V
CMOS low power dissipation
Direct interface with TTL levels
IOFF circuitry provides partial Power-down mode operation
Balanced propagation delays
All inputs have Schmitt-trigger action
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C
Applications
Serial-to-parallel data conversion
Remote control holding register
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC595ABQ | 1.2?-?5.5 | CMOS/LVTTL | ± 24 | 4.0 | 180 | 8 | low | -40~125 | 92 | 13.3 | 61 | DHVQFN16 |
| 74LVC595ABZ | 1.2?-?5.5 | CMOS/LVTTL | low | -40~125 | DHXQFN16 | |||||||
| 74LVC595AD | 1.2?-?5.5 | CMOS/LVTTL | ± 24 | 4.0 | 180 | 8 | low | -40~125 | 91 | 9.3 | 51 | SO16 |
| 74LVC595APW | 1.2?-?5.5 | CMOS/LVTTL | ± 24 | 4.0 | 180 | 8 | low | -40~125 | 124 | 4.4 | 53.9 | TSSOP16 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC595ABQ | 74LVC595ABQ,115 (935282468115) |
Active | VC595A |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74LVC595ABZ | 74LVC595ABZX (935692229115) |
Active | V595 |
DHXQFN16 (SOT8016-1) |
SOT8016-1 | SOT8016-1_115 | |
| 74LVC595AD | 74LVC595AD,118 (935282469118) |
Active | 74LVC595AD |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74LVC595APW | 74LVC595APW,118 (935282471118) |
Active | LVC595A |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC595ABQ | 74LVC595ABQ,115 | 74LVC595ABQ |
|
|
| 74LVC595ABZ | 74LVC595ABZX | 74LVC595ABZ |
|
|
| 74LVC595AD | 74LVC595AD,118 | 74LVC595AD |
|
|
| 74LVC595APW | 74LVC595APW,118 | 74LVC595APW |
|
|
文檔 (23)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC595A | 8-bit serial-in/serial-out or parallel-out shift register; 3-state | Data sheet | 2025-05-09 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| mbc319 | Block diagram: 74LVC595ABQ, 74LVC595AD, 74LVC595APW | Block diagram | 2009-11-03 |
| mbc320 | Block diagram: 74LVC595ABQ, 74LVC595AD, 74LVC595APW | Block diagram | 2009-11-03 |
| mbc321 | Block diagram: 74AHC594BQ, 74AHC594D, 74AHC594DB, 74AHC594PW, 74AHCT594BQ, 74AHCT594D, 74AHCT594DB, 74AHCT594PW, 74LVC595ABQ, 74LVC595AD, 74LVC595APW | Block diagram | 2009-11-04 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT8016-1 | 3D model for products with SOT8016-1 package | Design support | 2023-02-07 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | Package information | 2023-02-03 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT8016-1 | 3D model for products with SOT8016-1 package | Design support | 2023-02-07 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
Ordering, pricing & availability
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