74AHC541-Q100; 74AHCT541-Q100
Octal buffer/line driver; 3-state
The 74AHC541-Q100; 74AHCT541-Q100 is an 8?-?bit buffer/line driver with 3?-?state outputs. The device features two output enables (OE1 and OE2). A HIGH on OEn causes the associated outputs to assume a high?-?impedance OFF?-?state. Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 to 5.5 V
Balanced propagation delays
High noise immunity
All inputs have a Schmitt-trigger action
Overvoltage tolerant inputs to 5.5 V
CMOS low power dissipation
Input levels:
For 74AHC541: CMOS level
For 74AHCT541: TTL level
Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC541BQ-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | 78 | 9.2 | 50 | DHVQFN20 |
| 74AHC541D-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | 85 | 27.4 | 61 | SO20 |
| 74AHC541PW-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
| 74AHCT541BQ-Q100 | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | 78 | 9.2 | 50 | DHVQFN20 |
| 74AHCT541D-Q100 | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | 85 | 27.4 | 61 | SO20 |
| 74AHCT541PW-Q100 | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC541BQ-Q100 | 74AHC541BQ‑Q100X (935300707115) |
Active | AHC541 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHC541D-Q100 | 74AHC541D‑Q100J (935300705118) |
Active | 74AHC541D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHC541PW-Q100 | 74AHC541PW‑Q100J (935300706118) |
Active | AHC541 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74AHCT541BQ-Q100 | 74AHCT541BQ‑Q100X (935300711115) |
Active | AHCT541 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHCT541D-Q100 | 74AHCT541D‑Q100J (935300708118) |
Active | 74AHCT541D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHCT541PW-Q100 | 74AHCT541PW‑Q100J (935300709118) |
Active | AHCT541 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC541BQ-Q100 | 74AHC541BQ‑Q100X | 74AHC541BQ-Q100 |
|
|
| 74AHC541D-Q100 | 74AHC541D‑Q100J | 74AHC541D-Q100 |
|
|
| 74AHC541PW-Q100 | 74AHC541PW‑Q100J | 74AHC541PW-Q100 |
|
|
| 74AHCT541BQ-Q100 | 74AHCT541BQ‑Q100X | 74AHCT541BQ-Q100 |
|
|
| 74AHCT541D-Q100 | 74AHCT541D‑Q100J | 74AHCT541D-Q100 |
|
|
| 74AHCT541PW-Q100 | 74AHCT541PW‑Q100J | 74AHCT541PW-Q100 |
|
|
文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT541_Q100 | Octal buffer/line driver; 3-state | Data sheet | 2023-09-06 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc541 | ahc541 IBIS model | IBIS model | 2013-04-08 |
| ahct541 | ahct541 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc541 | ahc541 IBIS model | IBIS model | 2013-04-08 |
| ahct541 | ahct541 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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