74AUP1G14-Q100
Low-power Schmitt trigger inverter
The 74AUP1G14-Q100 is a single inverter with Schmitt-trigger input. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 0.8 V to 3.6 V
CMOS low power dissipation
High noise immunity
Overvoltage tolerant inputs to 3.6 V
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Applications
Wave and pulse shaper
Astable multivibrator
Monostable multivibrator
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP1G14GW-Q100 | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 1 | ultra low | -40~125 | 309 | 179 | TSSOP5 |
| 74AUP1G14GX4-Q100 | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 1 | ultra low | -40~125 | 4 | X2SON4 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP1G14GW-Q100 | 74AUP1G14GW‑Q100H (935691564125) |
Active | pF |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AUP1G14GX4-Q100 | 74AUP1G14GX4‑Q100Z (935691177147) |
Active | pF |
X2SON4 (SOT1269-2) |
SOT1269-2 | SOT1269-2_147 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP1G14GW-Q100 | 74AUP1G14GW‑Q100H | 74AUP1G14GW-Q100 |
|
|
| 74AUP1G14GX4-Q100 | 74AUP1G14GX4‑Q100Z | 74AUP1G14GX4-Q100 |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AUP1G14_Q100 | Low-power Schmitt trigger inverter | Data sheet | 2023-10-27 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
| SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
| aup1g14 | 74AUP1G14 IBIS model | IBIS model | 2018-05-25 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| XSON4_SOT1269-2_mk | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Marcom graphics | 2019-02-04 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Package information | 2020-08-18 |
| 74AUP1G14GX4-Q100_Nexperia_Product_Reliability | 74AUP1G14GX4-Q100 Nexperia Product Reliability | Quality document | 2025-03-20 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
| SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
| aup1g14 | 74AUP1G14 IBIS model | IBIS model | 2018-05-25 |
Ordering, pricing & availability
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