74HC14-Q100; 74HCT14-Q100
Hex inverting Schmitt trigger
The 74HC14-Q100; 74HCT14-Q100 is a hex inverter with Schmitt-trigger inputs. This device features reduced input threshold levels to allow interfacing to TTL logic levels. Inputs also include clamp diodes, this enables the use of current limiting resistors to interface inputs to voltages in excess of VCC. Schmitt trigger inputs transform slowly changing input signals into sharply defined jitter-free output signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
High noise immunity
Unlimited input rise and fall times
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Applications
Wave and pulse shapers
Astable multivibrators
Monostable multivibrators
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC14BQ-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 36 | 6 | low | -40~125 | 106 | 20.4 | 73 | DHVQFN14 |
| 74HC14D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 36 | 6 | low | -40~125 | 107 | 19.7 | 66 | SO14 |
| 74HC14PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 36 | 6 | low | -40~125 | 140 | 7.63 | 66.6615486725664 | TSSOP14 |
| 74HCT14BQ-Q100 | 4.5?-?5.5 | TTL | ± 4 | 36 | 6 | low | -40~125 | 106 | 20.4 | 73 | DHVQFN14 |
| 74HCT14D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 36 | 6 | low | -40~125 | 107 | 19.7 | 66 | SO14 |
| 74HCT14PW-Q100 | 4.5?-?5.5 | TTL | ± 4 | 36 | 6 | low | -40~125 | 140 | 7.63 | 66.6615486725664 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC14BQ-Q100 | 74HC14BQ‑Q100,115 (935298439115) |
Active | HC14 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74HC14D-Q100 | 74HC14D‑Q100,118 (935298441118) |
Active | 74HC14D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HC14PW-Q100 | 74HC14PW‑Q100,118 (935298442118) |
Active | HC14 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74HCT14BQ-Q100 | 74HCT14BQ‑Q100,115 (935298443115) |
Active | HCT14 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74HCT14D-Q100 | 74HCT14D‑Q100,118 (935298444118) |
Active | 74HCT14D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HCT14PW-Q100 | 74HCT14PW‑Q100,118 (935298445118) |
Active | HCT14 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC14BQ-Q100 | 74HC14BQ‑Q100,115 | 74HC14BQ-Q100 |
|
|
| 74HC14D-Q100 | 74HC14D‑Q100,118 | 74HC14D-Q100 |
|
|
| 74HC14PW-Q100 | 74HC14PW‑Q100,118 | 74HC14PW-Q100 |
|
|
| 74HCT14BQ-Q100 | 74HCT14BQ‑Q100,115 | 74HCT14BQ-Q100 |
|
|
| 74HCT14D-Q100 | 74HCT14D‑Q100,118 | 74HCT14D-Q100 |
|
|
| 74HCT14PW-Q100 | 74HCT14PW‑Q100,118 | 74HCT14PW-Q100 |
|
|
文檔 (18)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT14_Q100 | Hex inverting Schmitt trigger | Data sheet | 2024-02-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| hc14 | 74HC14 IBIS Model | IBIS model | 2023-01-20 |
| hct14 | 74HCT14 IBIS Model | IBIS model | 2023-01-20 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| hc14 | 74HC14 IBIS Model | IBIS model | 2023-01-20 |
| hct14 | 74HCT14 IBIS Model | IBIS model | 2023-01-20 |
Ordering, pricing & availability
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