74LVC1G14-Q100
Single Schmitt trigger inverter
The 74LVC1G14-Q100 is a single inverter with Schmitt-trigger inputs. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
IOFF circuitry provides partial Power-down mode operation
±24 mA output drive (VCC = 3.0 V)
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Unlimited rise and fall times
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD36 (4.5 V to 5.5 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Applications
Wave and pulse shaper
Astable multivibrator
Monostable multivibrator
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G14GM-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 320 | 8.2 | 163 | XSON6 |
| 74LVC1G14GV-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 278 | 68.5 | 175 | TSOP5 |
| 74LVC1G14GW-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 319 | 88 | 188 | TSSOP5 |
| 74LVC1G14GX4-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 4 | X2SON4 | ||
| 74LVC1G14GZ-Q100 | 1.65?-?5.5 | CMOS/LVTTL | low | -40~125 | XSON5 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G14GM-Q100 | 74LVC1G14GM‑Q100X (935690763115) |
Active | VF |
XSON6 (SOT886) |
SOT886 | SOT886_115 | |
| 74LVC1G14GV-Q100 | 74LVC1G14GV‑Q100,1 (935298479125) |
Active | V14 |
TSOP5 (SOT753) |
SOT753 |
WAVE_BG-BD-1
|
SOT753_125 |
| 74LVC1G14GW-Q100 | 74LVC1G14GW‑Q100,1 (935298481125) |
Active | VF |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74LVC1G14GX4-Q100 | 74LVC1G14GX4‑Q100Z (935691178147) |
Active | VF |
X2SON4 (SOT1269-2) |
SOT1269-2 | SOT1269-2_147 | |
| 74LVC1G14GZ-Q100 | 74LVC1G14GZ‑Q100YL (935691692315) |
Active | VF |
XSON5 (SOT8065-1) |
SOT8065-1 | SOT8065-1_315 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G14GM-Q100 | 74LVC1G14GM‑Q100X | 74LVC1G14GM-Q100 |
|
|
| 74LVC1G14GV-Q100 | 74LVC1G14GV‑Q100,1 | 74LVC1G14GV-Q100 |
|
|
| 74LVC1G14GW-Q100 | 74LVC1G14GW‑Q100,1 | 74LVC1G14GW-Q100 |
|
|
| 74LVC1G14GX4-Q100 | 74LVC1G14GX4‑Q100Z | 74LVC1G14GX4-Q100 |
|
|
| 74LVC1G14GZ-Q100 | 74LVC1G14GZ‑Q100YL | 74LVC1G14GZ-Q100 |
|
|
文檔 (26)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC1G14_Q100 | Single Schmitt trigger inverter | Data sheet | 2024-11-15 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
| SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| lvc1g14 | 74LVC1G14 IBIS model | IBIS model | 2018-05-25 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Leaflet_SOT8065_Minilogic | Leaflet_SOT8065 Minilogic | Leaflet | 2024-11-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| XSON4_SOT1269-2_mk | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Marcom graphics | 2019-02-04 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Package information | 2020-08-18 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-08-28 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要設(shè)計/技術(shù)支持，請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
| SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| lvc1g14 | 74LVC1G14 IBIS model | IBIS model | 2018-05-25 |
Ordering, pricing & availability
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。