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Click here for more information74ABT125DB
Quad buffer; 3-state
The 74ABT125 is a quad buffer/line driver with 3-state outputs controlled by the output enable inputs (nOE). A HIGH on nOE causes the outputs to assume a high impedance OFF-state. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Alternatives
Features and benefits
Supply voltage range from 4.5 V to 5.5 V
BiCMOS high speed and output drive
Direct interface with TTL levels
Power-up 3-state
Inputs are disabled during 3-state mode
IOFF circuitry provides partial Power-down mode operation
Latch-up protection exceeds 500 mA per JESD78B class II level A
Quad bus interface
3-state buffers
Live insertion and extraction permitted
Output capability: HIGH -32 mA; LOW +64 mA
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C
參數(shù)類(lèi)型
| 型號(hào) | Package name |
|---|---|
| 74ABT125DB | SSOP14 |
PCB Symbol, Footprint and 3D Model
| Model Name | 描述 |
|---|---|
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封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ABT125DB | 74ABT125DB,118 (935181280118) |
Withdrawn / End-of-life |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
SOT337-1_118 | |
| 74ABT125DB,112 (935181280112) |
Obsolete | 暫無(wú)信息 |
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ABT125DB | 74ABT125DB,118 | 74ABT125DB |
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| 74ABT125DB | 74ABT125DB,112 | 74ABT125DB |
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文檔 (10)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74ABT125 | Quad buffer; 3-state | Data sheet | 2025-09-18 |
| AN241 | Thermal Considerations for Advanced Logic Families | Application note | 2022-12-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| abt125 | abt125 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| abt | abt Spice model | SPICE model | 2013-05-07 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
PCB Symbol, Footprint and 3D Model
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.