74LVT241
3.3 V octal buffer/line driver; 3-state
The 74LVT241 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive.
This device is an octal buffer that is ideal for driving bus lines. The device features two output enables (1OE, 2OE), each controlling four of the 3-state outputs.
Features and benefits
3-state buffers
Octal bus interface
Input and output interface capability to systems at 5 V supply
TTL input and output switching levels
Output capability: +64 mA/-32 mA
Latch-up protection exceeds 500 mA per JESD78 class II level A
Bus-hold data inputs eliminate the need for external pull-up resistors for unused inputs
Live insertion/extraction permitted
Power-up 3-state
No bus current loading when output is tied to 5 V bus
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name | |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVT241BQ | 2.7?-?3.6 | TTL | -32 / +64 | 150 | 8 | medium | -40~85 | 77 | 48 | DHVQFN20 | |
| 74LVT241D | 2.7?-?3.6 | TTL | -32 / +64 | 150 | 8 | medium | -40~85 | 84 | 25.8 | 60 | SO20 |
| 74LVT241PW | 2.7?-?3.6 | TTL | -32 / +64 | 150 | 8 | medium | -40~85 | 100 | 4.3 | 44 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVT241BQ | 74LVT241BQ,115 (935285601115) |
Active | LVT241BQ |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74LVT241D | 74LVT241D,118 (935210080118) |
Active | 74LVT241D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74LVT241PW | 74LVT241PW,118 (935210110118) |
Active | LVT241 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVT241DB | 74LVT241DB,112 (935210090112) |
Obsolete | LVT241 |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
| 74LVT241DB,118 (935210090118) |
Obsolete | LVT241 | SOT339-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVT241BQ | 74LVT241BQ,115 | 74LVT241BQ |
|
|
| 74LVT241D | 74LVT241D,118 | 74LVT241D |
|
|
| 74LVT241PW | 74LVT241PW,118 | 74LVT241PW |
|
|
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVT241DB | 74LVT241DB,112 | 74LVT241DB |
|
|
| 74LVT241DB | 74LVT241DB,118 | 74LVT241DB |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVT241 | 3.3 V octal buffer/line driver; 3-state | Data sheet | 2024-07-08 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvt241 | lvt241 IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| lvt | lvt Spice model | SPICE model | 2013-05-07 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvt241 | lvt241 IBIS model | IBIS model | 2013-04-09 |
| lvt | lvt Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
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